# US 12,604,529 B2 · Display device and method for manufacturing display device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,529 B2 - Document ID: US12604529B2 - Status: Granted - Kind: B2 - Application number: 18/246,739 - Filed: 2021-10-05 - Published: 2023-11-16 - Granted: 2026-04-14 - Earliest claimed: 2020-10-23 - Assignees: Toray Industries, Inc. - Applicants: Toray Industries, Inc. - Inventors: Keika Hashimoto; Yuki Masuda; Yu Shoji - Web page: https://patentgrep.com/patent/US12604529B2 ## CPC - H10D 86/60: wherein the TFTs are in active matrices - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - G09F 9/00: Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements (in which the variable information is permanently attached to a movable support G09F11/00; abacus G06C1/00; slide-rules G06G1/00) - G09F 9/30: in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) - G09F 9/33: being semiconductor devices, e.g. diodes - H10D 86/021: {of multiple TFTs} - H10D 86/451: {characterised by the compositions or shapes of the interlayer dielectrics} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10W 70/611: {for connecting multiple chips together} - H10W 70/685: comprising multiple insulating layers - H10W 90/00: Package configurations - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10D 86/441: {Interconnections, e.g. scanning lines} - H10H 20/0364: {of interconnections} - H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract What is addressed is the problem of degradation of design of an LED display device due to insufficient concealment of wiring by an insulating film for peripheral wiring insulation, a protection film, an isolating wall and the like. This display device comprises at least metal wires, a cured film, and a plurality of light emitting elements, the light emitting elements having a pair of electrode terminals on one surface thereof, the pair of electrode terminals connecting to a plurality of the metal wires extending in the cured film, the plurality of the metal wires being configured to retain an electrical insulating property due to the cured film, wherein the cured film is a film obtained by curing a resin composition comprising an (A) resin, wherein the transmittance of light of a wavelength 450 nm at a thickness reference 5 μm of the cured film is 0.1% to 79% inclusive. ## Claims ### Claim 1 A display comprising at least metal wires, a cured film, and a plurality of light emitting elements, each of the light emitting elements having a pair of electrode terminals on one face thereof, the pair of electrode terminals being connected to the plurality of metal wires extending in the cured film, the plurality of metal wires being electrically insulated by the cured film, the cured film being a film formed by curing a resin composition containing a resin (A), and the cured film having a transmittance for 1 μm thickness of 0.1% or more and 95% or less for light with a wavelength of 450 nm. ### Claim 2 (depends on 1) A display device as set forth in claim 1, wherein the cured film had a transmittance for 5 μm thickness of 0.1% or more and 79% or less for light with a wavelength of 450 nm. ### Claim 3 (depends on 1) A display device as set forth in claim 1, wherein the cured film had a transmittance for 1 μm thickness of 0.1% or more and 25% or less for light with a wavelength of 450 nm. ### Claim 4 (depends on 1) A display as set forth in claim 1, wherein the cured film has a total thickness of 5 to 100 μm. ### Claim 5 (depends on 1) A display as set forth in claim 1, wherein the cured film has 2 or more and 10 or less layers. ### Claim 6 (depends on 1) A display as set forth in claim 1, wherein the cured film has a hole pattern that penetrates it in the thickness direction; the metal wires extend at least in the hole pattern; and the bottom face portion of each metal wire that is formed at a position where it is in contact with a light emitting element has a maximum size of 2 to 20 μm. ### Claim 7 (depends on 1) A display as set forth in claim 1, wherein the cured film covers the faces of each light emitting element other than the light extraction face. ### Claim 8 (depends on 1) A display as set forth in claim 1, wherein partition walls having a thickness larger than the thickness of the light emitting elements are disposed between the two or more light emitting elements. ### Claim 9 (depends on 1) A display as set forth in claim 1, wherein each light emitting element is an LED having sides of 5 μm or more and 700 μm or less. ### Claim 10 (depends on 1) A display as set forth in claim 1, further comprising a drive element and a substrate in such a manner that the drive element is connected to the light emitting elements by metal wires and that at least part of the metal wires extends along a side face of the substrate. ### Claim 11 (depends on 1) A display as set forth in claim 1, wherein shading layers are disposed between the two or more light emitting elements. ### Claim 12 (depends on 1) A display as set forth in claim 1, wherein the resin (A) contains one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, and copolymers thereof. ### Claim 13 (depends on 1) A display as set forth in claim 1, wherein the resin composition containing the resin (A) further includes a photosensitizing agent (B). ### Claim 14 (depends on 1) A display as set forth in claim 1, wherein the resin composition containing the resin (A) further includes a coloring agent (C) and the coloring agent (C) includes a coloring agent (C-1) that has an absorption maximum in the wavelength range of 400 nm or more and 490 nm or less. ### Claim 15 (depends on 1) A display as set forth in claim 1, wherein the resin composition containing the resin (A) further includes a coloring agent (C) and the coloring agent (C) includes a coloring agent (C-2) that has an absorption maximum in the wavelength range of more than 490 nm and 580 nm or less. ### Claim 16 (depends on 1) A display as set forth in claim 1, wherein the resin composition containing the resin (A) further includes a coloring agent (C) and the coloring agent (C) includes a coloring agent (C-3) that has an absorption maximum in the wavelength range of more than 580 nm and 800 nm or less. ### Claim 17 (depends on 1) A display as set forth in claim 1, wherein the coloring agent (C) further includes, along with the coloring agent (C-1), a coloring agent (C-2) that has an absorption maximum in the wavelength range of more than 490 nm and 580 nm or less and a coloring agent (C-3) that has an absorption maximum in the wavelength range of more than 580 nm and 800 nm or less. ### Claim 18 (depends on 1) A display as set forth in claim 1, wherein the resin composition containing the resin (A) has positive photosensitivity. ### Claim 19 A production method for a display having at least metal wires, a cured film, and a plurality of light emitting elements comprising: a step (D1) for arranging the light emitting elements on a support substrate, a step (D2) for forming a resin film from a resin composition containing a resin (A) on the support substrate and on the light emitting elements, a step (D3) for irradiating and developing the resin film to form a plurality of through-hole patterns in the resin film, a step (D6) for curing the resin film to form a cured film having a transmittance for 1 μm thickness of 0.1% or more and 95% or less for light with a wavelength of 450 nm, and a step (D5) for forming the metal wires on at least part of the surface of the cured film and in the hole patterns in the cured film. ### Claim 20 (depends on 19) A production method for a display as set forth in claim 19, wherein the step (D2), step (D3), step (D6), and step (D5) are carried out a plurality of times repeatedly to form a plurality of cured film layers in which each cured film layer contains metal wires. ### Claim 21 A production method for a display having at least metal wires, a cured film, and a plurality of light emitting elements comprising: a step (E1) for disposing a metal pad on a support substrate, a step (E2) for forming a resin film from a resin composition containing a resin (A) on the support substrate and on the metal pad, a step (E3) for irradiating and developing the resin film to form a plurality of through-hole patterns that penetrate the resin film, a step (E10) for curing the resin film to form the cured film having a transmittance for 1 μm thickness of 0.1% or more and 95% or less for light with a wavelength 450 nm, a step (E5) for forming the metal wires on at least part of the surface of the cured film and in the hole patterns in the cured film, and a step (E6) for arranging the light emitting elements on the cured film while maintaining electric connection with the metal wires. ### Claim 22 (depends on 21) A production method for a display as set forth in claim 21, wherein the step (E2), step (E3), step (E10), and step (E5) are carried out a plurality of times repeatedly to form a plurality of cured film layers in which each cured film layer contains metal wires. ### Claim 23 (depends on 21) A production method for a display as set forth in claim 21, wherein a step (E9) for forming partition walls with a thickness larger than the thickness of the light emitting elements is provided after the step (E5).