Universal electrically inactive devices for integrated circuit packages

An integrated circuit device, comprising:

• an electronic substrate;
• an inactive device substrate having a first surface, an opposing second surface, and a plurality of edges surrounding the first surface;
• a metallization layer extending between the edges and across the first surface to completely cover the first surface of the inactive device substrate, wherein the metallization layer is attached to the electronic substrate by a plurality of first solder interconnects in direct contact with the metallization layer;
• and
• an active integrated circuit device, wherein the active integrated circuit device is attached to the electronic substrate by a plurality of second solder interconnects.

An integrated circuit device, comprising:

• an electronic substrate;
• an inactive device substrate having a first surface, an opposing second surface, and a plurality of edges surrounding the first surface;
• a metallization layer extending across the first surface from at least a first edge of the plurality of edges to a second edge of the plurality of edges opposite the first edge, wherein the metallization layer is attached to the electronic substrate by a plurality of first interconnects in direct contact with the metallization layer and in direct contact with first bond pads of the electronic substrate;
• and
• an active integrated circuit device, wherein the active integrated circuit device is attached to the electronic substrate by a plurality of second interconnects in direct contact with second bond pads of the electronic substrate.