# US 12,604,446 B2 · Integrated device package with reduced thickness > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,446 B2 - Document ID: US12604446B2 - Status: Granted - Kind: B2 - Application number: 18/190,844 - Filed: 2023-03-27 - Published: 2023-10-26 - Granted: 2026-04-14 - Earliest claimed: 2022-03-30 - Assignees: Skyworks Solutions, Inc. - Applicants: Skyworks Solutions, Inc. - Inventors: Anthony James LoBianco; Hoang Mong Nguyen; Yi Liu - Web page: https://patentgrep.com/patent/US12604446B2 ## CPC - H05K 9/0022: {of components mounted on printed circuit boards [PCB] (shields integrated within PCB H05K1/0218; shields integrated within component packages H10W42/20)} - H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/273: {the arrangements being between laterally adjacent chips, e.g. walls between chips} - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10W 74/01: Manufacture or treatment - H10W 74/114: {by a substrate and the encapsulations} - H03H 9/0542: {consisting of a lateral arrangement (H03H9/0566 takes precedence)} - H03H 9/64: using surface acoustic waves - H10W 46/101: {characterised by the type of information, e.g. logos or symbols} - H10W 46/103: {alphanumeric information, e.g. words, letters or serial numbers} - H10W 46/106: {digital information, e.g. bar codes} - H10W 46/301: {for alignment} - H10W 46/401: {for identification or tracking} - H10W 46/607: {Located on parts of packages, e.g. on encapsulations or on package substrates} - H10W 74/014: {using batch processing} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract An integrated device package is disclosed. The integrated device package can include a carrier, an electronic component mounted on the carrier, a molding material disposed over the carrier, and an electromagnetic interference shield layer disposed over the molding material. The electronic component is at least partially disposed in the molding material. At least a portion of the shield layer is in contact with the electronic component. The electromagnetic interference shield layer is configured to shield the electronic component from a radio frequency signal. A surface of the electromagnetic interference shield layer includes an ink mark or a laser mark. ## Claims ### Claim 1 An integrated device package comprising: a carrier; at least first and second electronic components mounted to the carrier; a molding material disposed over the carrier, the molding material surrounding and between the first and second electronic components, the first electronic component embedded within the molding material, the second electronic component disposed in the molding material with an upper surface of the second electronic component coplanar with an upper surface of the molding material; a ground connection embedded within the molding material that extends from the carrier to a recess in the upper surface of the molding material, the ground connection positioned in the molding material between the first and second electronic components; a through mold via positioned in the molding material between the ground connection and the second electronic component to provide mechanical separation between a first portion of the molding material surrounding the first electronic component and a second portion of the molding material surrounding the second electronic component; and an electromagnetic interference shield layer disposed over the first and second electronic components, the recess, and the through mold via, at least a portion of the electromagnetic interference shield layer in contact with the ground connection exposed in the recess, the electromagnetic interference shield layer configured to shield the first and second electronic components from a radio frequency, an upper surface of the electromagnetic interference shield layer having a plurality of recesses, the plurality of recesses including markings. ### Claim 2 (depends on 1) The integrated device package of claim 1 wherein the upper surface of the molding material has a plurality of recesses that include markings. ### Claim 3 (depends on 2) The integrated device package of claim 2 wherein the electromagnetic interference shield layer is disposed over the plurality of recesses in the upper surface of the molding material to form the plurality of recesses in the electromagnetic interference shield layer. ### Claim 4 (depends on 3) The integrated device package of claim 3 wherein the first electronic component is not as high as the second electronic component. ### Claim 5 (depends on 4) The integrated device package of claim 4 wherein the through mold via is filled with a conductive material. ### Claim 6 (depends on 4) The integrated device package of claim 4 wherein the through mold via is filled with an electromagnetic interference shielding material. ### Claim 7 (depends on 2) The integrated device package of claim 2 wherein the ground connection includes a conductive wire. ### Claim 8 (depends on 1) The integrated device package of claim 1 wherein the carrier is an organic printed circuit board (PCB). ### Claim 9 (depends on 1) The integrated device package of claim 1 wherein the first electronic component is an integrated device die or a passive component. ### Claim 10 (depends on 1) The integrated device package of claim 1 wherein the first electronic component is an acoustic wave device. ### Claim 11 (depends on 10) The integrated device package of claim 10 wherein the first electronic component is a filter. ### Claim 12 (depends on 1) The integrated device package of claim 1 further comprising an acoustic wave device mounted on the carrier. ### Claim 13 (depends on 1) The integrated device package of claim 1 wherein the electromagnetic interference shield layer is conformally disposed over and in the through mold via. ### Claim 14 (depends on 1) The integrated device package of claim 1 wherein the through mold via is partially filed with an isolating material. ### Claim 15 (depends on 1) The integrated device package of claim 1 wherein the markings in the electromagnetic interference shield layer comprise ink with a thickness that exceeds a depth of the plurality of recesses. ### Claim 16 (depends on 1) The integrated device package of claim 1 wherein an upper surface of the molding material that is in contact with the electromagnetic interference shield layer has a flat surface. ### Claim 17 A integrated device package comprising: a carrier; at least a first and second electronic components mounted to the carrier, the first and second electronic components having a first surface facing the carrier and a second surface opposite the first surface; a molding material disposed over the carrier, the molding material surrounding and between the first and second electronic components, the first electronic component embedded within the molding material, the second electronic component disposed in the molding material, the molding material having a lower surface facing the carrier and an upper surface opposite the lower surface and coplanar with the second surface of the second electronic component; a ground connection embedded within the molding material that extends from the carrier to a recess in the upper surface of the molding material, the ground connection positioned in the molding material between the first and second electronic components; a through mold via positioned in the molding material between the ground connection and the second electronic component to provide mechanical separation between a first portion of the molding material surrounding the first electronic component and a second portion of the molding material surrounding the second electronic component; and an electromagnetic interference shield layer disposed over the first and second electronic components, the recess, and the through mold via, the electromagnetic interference shield layer in contact with the ground connection exposed in the recess, the electromagnetic interference shield layer configured to shield the first and second electronic components from a radio frequency signal, an upper surface of the electromagnetic interference shield layer having a plurality of recesses, the plurality of recesses including markings. ### Claim 18 (depends on 17) The integrated device package of claim 17 wherein the first and second electronic components have an acoustic wave filter, and wherein the carrier is a printed circuit board (PCB). ### Claim 19 (depends on 17) The integrated device package of claim 17 wherein the upper surface of the molding material has a plurality of recesses that include markings. ### Claim 20 (depends on 19) The integrated device package of claim 19 wherein the electromagnetic interference shield layer is disposed over the plurality of recesses in the upper surface of the molding material to form the plurality of recesses in the electromagnetic interference shield layer.