# US 12,604,415 B2 · Circuit board structure and method for manufacturing the same

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- Number: US 12,604,415 B2
- Document ID: US12604415B2
- Status: Granted
- Kind: B2
- Application number: 18/522,250
- Filed: 2023-11-29
- Published: 2025-03-13
- Granted: 2026-04-14
- Earliest claimed: 2023-09-08
- Assignees: Tong Hsing Electronic Industries, Ltd.
- Applicants: Tong Hsing Electronic Industries, Ltd.
- Inventors: Yu-Hsien Liao; Shih-Han Wu; Jhih-Wei Lai; Jian-Yu Shih; Ming-Yen Pan
- Web page: https://patentgrep.com/patent/US12604415B2

## CPC

- H05K 3/12: using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
- H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence)
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/3452: Solder masks
- H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.

## Claims

### Claim 1

A circuit board structure, comprising:
a substrate having a conductive structure;
a solder mask coupler disposed on the substrate;
a supporter contacting the solder mask coupler, wherein the solder mask coupler is sandwiched between the substrate and the supporter, and the solder mask coupler directly binds the substrate and the supporter to fix the supporter onto the substrate; and
a chip disposed on the substrate, and being electrically connected with the conductive structure.

### Claim 2 (depends on 1)

The circuit board structure according to claim 1, wherein a bottom surface of the supporter contacts the solder mask coupler, and the bottom surface of the supporter has a protruding part embedded into the solder mask coupler.

### Claim 3 (depends on 1)

The circuit board structure according to claim 1, wherein the supporter has a top surface and a bottom surface opposite to each other, the bottom surface of the supporter contacts the solder mask coupler, and an area of the bottom surface is larger than an area of the top surface.

### Claim 4 (depends on 3)

The circuit board structure according to claim 3, wherein the bottom surface of the supporter has a protruding part embedded into the solder mask coupler.

### Claim 5 (depends on 1)

The circuit board structure according to claim 1, wherein the supporter is a non-conductive material.

### Claim 6 (depends on 1)

The circuit board structure according to claim 1, wherein a material of the solder mask coupler includes a barium element.

### Claim 7 (depends on 1)

The circuit board structure according to claim 1, wherein the supporter and the substrate do not have an adhesive there-between.