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US 12,604,409 B2Granted
Photonic integrated circuit embedded substrate and photonic integrated circuit package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKwang Yun Kim, Kyung Sang Lim, Seung Eun Lee, Yong Hoon Kim
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Abstract
A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
Claims23
A photonic integrated circuit embedded substrate, comprising:
- an embedded insulating layer in which a photonic integrated circuit is disposed;
- and
- at least one first insulating layer stacked on one surface of the embedded insulating layer,
- wherein the at least one first insulating layer has an optical path extending in a stacking direction of the at least one first insulating layer.
1 more element
Dependencies are inferred from the claim text.