# US 12,604,406 B2 · Multilayer electronic substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,406 B2 - Document ID: US12604406B2 - Status: Granted - Kind: B2 - Application number: 18/260,485 - Filed: 2021-12-23 - Published: 2024-02-22 - Granted: 2026-04-14 - Earliest claimed: 2021-01-18 - Assignees: Sony Group Corporation - Applicants: Sony Group Corporation - Inventors: Kanahiro Shirota; Keiichi Hirano - Web page: https://patentgrep.com/patent/US12604406B2 ## CPC - H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) - H05K 1/148: {Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means} - H01R 12/716: {Coupling device provided on the PCB} - H01R 12/722: {coupling devices mounted on the edge of the printed circuits} - H01R 12/73: connecting to other rigid printed circuits or like structures - H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10189: Non-printed connector - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS ## Abstract Provided is a multilayer electronic substrate that includes a first substrate, a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other, a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate, a second connector mounted on the surface of the second substrate and electrically connected to a first wire of the second substrate, the second connector being directly connected to the first connector, and a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate, to electrically connect the second wire of the first substrate and the second wire of the second substrate. ## Claims ### Claim 1 A multilayer electronic substrate, comprising: a first substrate; a second substrate on the first substrate, wherein a surface of the first substrate faces a surface of the second substrate; a first connector on the surface of the first substrate, wherein the first connector is configured to electrically connect to a first wire of the first substrate; a second connector on the surface of the second substrate, wherein the second connector is configured to electrically connect to a first wire of the second substrate, and the second connector is directly connected to the first connector; and a flexible wiring member, wherein the flexible wiring member includes: a first end that is electrically connected to a second wire of the first substrate; and a second end that is electrically connected to a second wire of the second substrate, and the second wire of the first substrate is electrically connected to the second wire of the second substrate via the flexible wiring member. ### Claim 2 (depends on 1) The multilayer electronic substrate according to claim 1, further comprising at least one third connector on at least one of the first substrate or the second substrate, wherein the at least one third connector is configured to electrically connect at least one of a first portion between the second wire of the first substrate and the first end of the flexible wiring member or a second portion between the second wire of the second substrate and the second end of the flexible wiring member. ### Claim 3 (depends on 2) The multilayer electronic substrate according to claim 2, wherein the at least one third connector is on at least one of the surface of the first substrate or the surface of the second substrate. ### Claim 4 (depends on 3) The multilayer electronic substrate according to claim 3, wherein the at least one third connector is on both of the first substrate and the second substrate. ### Claim 5 (depends on 4) The multilayer electronic substrate according to claim 4, further comprising a fourth connector, wherein the at least one third connector is on the first substrate, the fourth connector is on the second substrate, and the at least one third connector does not overlap the fourth connector along a thickness direction. ### Claim 6 (depends on 1) The multilayer electronic substrate according to claim 1, further comprising a third connector that is on the second substrate, wherein the third connector is configured to electrically connect at least one of a first portion between the second wire of the first substrate and the first end of the flexible wiring member or a second portion between the second wire of the second substrate and the second end of the flexible wiring member. ### Claim 7 (depends on 2) The multilayer electronic substrate according to claim 2, wherein a pitch direction of a plurality of terminals of the third connector is parallel to each of a pitch direction of a plurality of terminals of the first connector and a pitch direction of a plurality of terminals of the second connector. ### Claim 8 (depends on 2) The multilayer electronic substrate according to claim 2, wherein a pitch direction of a plurality of terminals of the third connector is perpendicular to each of a pitch direction of a plurality of terminals of the first connector and a pitch direction of a plurality of terminals of the second connector. ### Claim 9 (depends on 2) The multilayer electronic substrate according to claim 2, wherein the flexible wiring member includes a first wiring member and a second wiring member, and a lengthwise direction of the second wiring member is perpendicular to a lengthwise direction of the first wiring member. ### Claim 10 (depends on 1) The multilayer electronic substrate according to claim 1, wherein the flexible wiring member includes a first wiring member and a second wiring member, and a lengthwise direction of the second wiring member is parallel to a lengthwise direction of the first wiring member.