# US 12,604,405 B2 · Mirror-core mounting multiple computer processor modules for minimized trace length > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,405 B2 - Document ID: US12604405B2 - Status: Granted - Kind: B2 - Application number: 17/703,717 - Filed: 2022-03-24 - Published: 2023-09-28 - Granted: 2026-04-14 - Earliest claimed: 2022-03-24 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Carl Williams; Steven Miller - Web page: https://patentgrep.com/patent/US12604405B2 ## CPC - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - G06F 1/184: Mounting of motherboards - G06F 1/20: Cooling means - H05K 7/1487: {Blade assemblies, e.g. blade cases or inner arrangements within a blade} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10545: Related components mounted on both sides of the PCB - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract Embodiments disclosed herein include a computer system. In an embodiment, the computer system comprises a printed circuit board assembly (PCBA) with a first surface and a second surface opposite from the first surface. In an embodiment, a first computer processor module is coupled to the first surface of the PCBA, and a second computer processor module is coupled to the second surface of the PCBA. In an embodiment, the first computer processor module is communicatively coupled to the second computer processor module through an electrical path that passes through a thickness of the PCBA. ## Claims ### Claim 1 A computer system, comprising: a printed circuit board assembly (PCBA) with a first surface and a second surface opposite from the first surface; a first computer processor module coupled to the first surface of the PCBA; and a second computer processor module coupled to the second surface of the PCBA, wherein the first computer processor module is communicatively coupled to the second computer processor module through an electrical path that passes through a thickness of the PCBA, and wherein a portion of the electrical path is through a first connector on a first PCB located outside of a footprint of the first computer processor module and through a second connector on second PCB located outside of a footprint of the second computer processor module from a plan view perspective; and a first stiffener, comprising metallic structures, is directly contacted with the first PCB and the PCBA; and a second stiffener, comprising metallic structures, is directly contacted with the second PCB and the PCBA; the first and second computer processor modules are mounted on the first and second PCBs respectively and completely overlap with the first and second stiffeners from a top or bottom view of the PCBA. ### Claim 2 (depends on 1) The computer system of claim 1, wherein the electrical path extends out beyond a footprint of the first computer processor module. ### Claim 3 (depends on 1) The computer system of claim 1, wherein the first computer processor module is directly over the second computer processor module. ### Claim 4 (depends on 1) The computer system of claim 1, wherein a length of the PCBA is less than approximately 1.0 meter. ### Claim 5 (depends on 4) The computer system of claim 4, wherein the length of the PCBA is less than approximately 0.6 meters. ### Claim 6 (depends on 1) The computer system of claim 1, further comprising: a first thermal solution over the first computer processor module; and a second thermal solution over the second computer processor module. ### Claim 7 (depends on 1) The computer system of claim 1, wherein the computer system is mounted to a chassis. ### Claim 8 (depends on 1) The computer system of claim 1, wherein the first computer processor module and the second computer processor module are part of an artificial intelligence (AI) computing module. ### Claim 9 (depends on 1) The computer system of claim 1, wherein a thickness of the computer system is approximately 10 rack units (U) or less. ### Claim 10 A computer system, comprising: a printed circuit board assembly (PCBA) with a first surface and a second surface opposite from the first surface; a first stiffener over the first surface of the PCBA; a first computer processor module coupled to the first stiffener; a second stiffener over the second surface of the PCBA; and a second computer processor module coupled to the second stiffener, wherein the first computer processor module is communicatively coupled to the second computer processor module through an electrical path that passes through a thickness of the PCBA, and wherein a portion of the electrical path is through a first connector on a first PCB located outside of a footprint of the first computer processor module and through a second connector on second PCB located outside of a footprint of the second computer processor module from a plan view perspective; and the first stiffener, comprising metallic structures, is directly contacted with the first PCB and the PCBA; and the second stiffener, comprising metallic structures, is directly contacted with the second PCB and the PCBA; the first and second computer processor modules are mounted on the first and second PCBs respectively and completely overlap with the first and second stiffeners from a top or bottom view of the PCBA. ### Claim 11 (depends on 10) The computer system of claim 10, wherein electrical connectors pass through the first stiffener and the second stiffener in order to couple the electrical path to the first computer processor module and the second computer processor module. ### Claim 12 (depends on 10) The computer system of claim 10, wherein the first computer processor module and the second computer processor module are part of an artificial intelligence (AI) computing module.