# US 12,604,400 B2 · Via and pad arrangement for printed circuit board

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,604,400 B2
- Document ID: US12604400B2
- Status: Granted
- Kind: B2
- Application number: 18/449,817
- Filed: 2023-08-15
- Published: 2025-02-20
- Granted: 2026-04-14
- Earliest claimed: 2023-08-15
- Assignees: Cisco Technology, Inc.
- Applicants: Cisco Technology, Inc.
- Inventors: Mike Sapozhnikov; David Nozadze; Joel Richard Goergen; Wenbin Ma; Upen Reddy Kareti; Weiying Ding
- Web page: https://patentgrep.com/patent/US12604400B2

## CPC

- H05K 1/113: {Via provided in pad; Pad over filled via}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0251: {related to vias or transitions between vias and transmission lines}
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 2201/09481: Via in pad; Pad over filled via
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

In some embodiments, an apparatus, includes a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB and a via formed through the pad. The via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance.

## Claims

### Claim 1

An apparatus, comprising:
a pad of a printed circuit board (PCB) configured to couple to an electrical component separate from the PCB; and
a via formed through the pad, wherein the via is offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance and crosstalk associated with the most adjacent trace is below a threshold level.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the pad is a first pad and the via is a first via, and the PCB comprises:
a second pad; and
a second via formed through the second pad, wherein the second via is offset from a center of the second pad and the first via is offset from the center of the first pad in opposite directions along an axis.

### Claim 3 (depends on 2)

The apparatus of claim 2, comprising:
a third pad positioned between the first pad and the second pad along the axis;
a third via formed through the third pad; and
the most adjacent trace, wherein the most adjacent trace is connected to the third via.

### Claim 4 (depends on 3)

The apparatus of claim 3, wherein the third via is centered on the third pad.

### Claim 5 (depends on 4)

The apparatus of claim 4, wherein the second via is offset from the center of the second pad and the first via is offset from the center of the first pad away from one another along the axis.

### Claim 6 (depends on 3)

The apparatus of claim 3, wherein the third via is offset from a center of the third pad along the axis.

### Claim 7 (depends on 6)

The apparatus of claim 6, wherein the second via is offset from the center of the second pad and the first via is offset from the center of the first pad toward one another along the axis.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the via is eccentrically positioned within a circumference of the pad.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the via is a ground via electrically coupled to a ground layer of the PCB and electrically separate from each trace of the PCB.

### Claim 10

An apparatus, comprising:
a pad of a printed circuit board (PCB), wherein the pad is configured to couple to an electrical component separate from the PCB;
a trace configured to propagate a signal; and
a via formed through the pad, wherein the via is electrically separate from the trace, and the via is offset from a center of the pad such that crosstalk associated with the trace is below a threshold level.

### Claim 11 (depends on 10)

The apparatus of claim 10, comprising an additional trace connected to the via.

### Claim 12 (depends on 11)

The apparatus of claim 11, wherein the trace and the additional trace are routed along different layers of the PCB, the PCB comprises dielectric material positioned between the trace and the additional trace, and the dielectric material comprises a dielectric constant below a threshold value.

### Claim 13 (depends on 10)

The apparatus of claim 10, wherein the threshold level is between-45 decibels (dB) and −55 dB.

### Claim 14 (depends on 10)

The apparatus of claim 10, comprising dielectric material positioned between the trace and the via, wherein the dielectric material comprises a dielectric constant below a threshold value.

### Claim 15 (depends on 14)

The apparatus of claim 14, wherein the threshold value is between 4 and 5.

### Claim 16

A method, comprising:
positioning a pad on a surface of a printed circuit board (PCB); and
forming a via through the pad at a position offset from a center of the pad such that a distance between the via and a most adjacent trace electrically separate from the via is above a threshold distance to limit crosstalk associated with the most adjacent trace below a threshold level.

### Claim 17 (depends on 16)

The method of claim 16, comprising:
positioning an additional pad on the surface of the PCB;
forming an additional via through the additional pad at a position centered on the additional pad; and
connecting the most adjacent trace to the additional via.

### Claim 18 (depends on 16)

The method of claim 16, comprising:
routing an additional trace along a layer of the PCB; and
connecting the additional trace to the via.

### Claim 19 (depends on 16)

The method of claim 16, comprising positioning dielectric material between the via and the most adjacent trace, wherein the dielectric material comprises a dielectric constant below a threshold value.

### Claim 20 (depends on 16)

The method of claim 16, comprising:
routing an additional trace along a layer of the PCB, wherein the additional trace is in inductive communication with the via; and
positioning dielectric material between the via and the additional trace, wherein the dielectric material comprises a dielectric constant above a threshold value.