# US 12,604,394 B2 · Optical transceiver equipped with ground via > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,394 B2 - Document ID: US12604394B2 - Status: Granted - Kind: B2 - Application number: 18/398,579 - Filed: 2023-12-28 - Published: 2025-07-03 - Granted: 2026-04-14 - Earliest claimed: 2023-12-28 - Assignees: Prime World International Holdings Ltd. - Applicants: Prime World International Holdings Ltd. - Inventors: Chao-Hung Tsai; Che-Shou Yeh; Ming-Chuan Wang - Web page: https://patentgrep.com/patent/US12604394B2 ## CPC - H05K 1/0228: {Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K1/0245)} - H05K 1/0219: {Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors} - H05K 1/117: {Pads along the edge of rigid circuit boards, e.g. for pluggable connectors} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 2201/09027: Non-rectangular flat PCB, e.g. circular - H05K 2201/09609: Via grid, i.e. two-dimensional array of vias or holes in a single plane - H05K 2201/10015: Non-printed capacitor - H05K 2201/10522: Adjacent components - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An optical transceiver includes a substrate, filtering capacitors, radio-frequency (RF) signal lines and ground vias. The substrate has two side edges and a distal edge, and has a main region and a golden finger region. The filtering capacitors are disposed in the main region on the substrate. The RF signal lines are connected to the filtering capacitors and each includes a first conductive portion disposed in the substrate and extending from the main region to the golden finger region, a second conductive portion disposed on the substrate and located in the golden finger region and a conductive via connecting the first conductive portion and the second conductive portion and extending no more than three layers of the substrate. The ground vias locate at the two side edges and the distal edge. A shortest distance between each RF signal line and the two side edges is larger than 0.95 mm. ## Claims ### Claim 1 An optical transceiver, comprising: a substrate having two side edges opposite to each other and a distal edge between the two side edges and having a main region and a golden finger region closer to the distal edge than the main region; a plurality of filtering capacitors disposed in the main region on the substrate; and a plurality of radio-frequency signal lines connected to the plurality of filtering capacitors and each comprising: a first conductive portion disposed in the substrate and extending from the main region to the golden finger region; a second conductive portion disposed on the substrate and located in the golden finger region; and a conductive via conductively connecting the first conductive portion and the second conductive portion and extending no more than three layers of the substrate; and a plurality of ground vias located at the two side edges and the distal edge, and the plurality of ground vias are distributed from the main region along the two side edges to the distal edge, wherein projections of the plurality of ground vias on the substrate are staggered with each other to define a fence structure; wherein a shortest distance between each one of the plurality of radio-frequency signal lines and the two side edges is larger than 0.95 mm. ### Claim 2 (depends on 1) The optical transceiver according to claim 1, wherein a shortest distance between a part of each one of the plurality of radio-frequency signal lines and each one of the two side edges is larger than 1.3 mm, wherein the part of each one of the plurality of radio-frequency signal lines and the distal edge have a distance of 8 mm therebetween. ### Claim 3 (depends on 1) The optical transceiver according to claim 1, wherein a shortest distance between each one of the plurality of radio-frequency signal lines and each of the two side edges is larger than 1.3 mm. ### Claim 4 (depends on 1) The optical transceiver according to claim 1, further comprising a shell, wherein the main region and the golden finger region is divided by the shell. ### Claim 5 (depends on 4) The optical transceiver according to claim 4, wherein a distance between each of the plurality of filtering capacitors and an edge of the shell that is closest to the distal edge is larger than 2.3 mm. ### Claim 6 (depends on 1) The optical transceiver according to claim 1, wherein the plurality of ground vias each penetrates the substrate. ### Claim 7 (depends on 1) The optical transceiver according to claim 1, wherein a part of the plurality of ground vias are located in the main region. ### Claim 8 (depends on 1) The optical transceiver according to claim 1, wherein each one of the plurality of radio-frequency signal lines further comprises a pair of differential signal lines, a distance between the pair of differential signal lines is less than three times of a width of each one of the pair of differential signal lines. ### Claim 9 An optical transceiver, comprising: a substrate having two side edges opposite to each other and a distal edge between the two side edges and having a main region and a golden finger region closer to the distal edge than the main region; a plurality of filtering capacitors disposed in the main region on the substrate; and a plurality of radio-frequency signal lines connected to the plurality of filtering capacitors and each comprising: a first conductive portion disposed in the substrate and extending from the main region to the golden finger region; a second conductive portion disposed on the substrate and located in the golden finger region; and a conductive via conductively connecting the first conductive portion and the second conductive portion and extending no more than three layers of the substrate; and a plurality of ground vias located at the two side edges and the distal edge and distributed from the main region to the golden finger region, wherein a shortest distance between each one of the plurality of radio-frequency signal lines and the two side edges is larger than 0.95 mm, wherein each one of the plurality of radio-frequency signal lines further comprises a pair of differential signal lines, a distance between the pair of differential signal lines is less than three times of a width of each one of the pair of differential signal lines. ### Claim 10 (depends on 9) The optical transceiver according to claim 9, wherein a shortest distance between a part of each one of the plurality of radio-frequency signal lines and each one of the two side edges is larger than 1.3 mm, wherein the part of each one of the plurality of radio-frequency signal lines and the distal edge have a distance of 8 mm therebetween. ### Claim 11 (depends on 9) The optical transceiver according to claim 9, wherein a shortest distance between each one of the plurality of radio-frequency signal lines and each of the two side edges is larger than 1.3 mm. ### Claim 12 (depends on 9) The optical transceiver according to claim 9, further comprising a shell, wherein the main region and the golden finger region is divided by the shell. ### Claim 13 (depends on 12) The optical transceiver according to claim 12, wherein a distance between each of the plurality of filtering capacitors and an edge of the shell that is closest to the distal edge is larger than 2.3 mm. ### Claim 14 (depends on 9) The optical transceiver according to claim 9, wherein the plurality of ground vias each penetrates the substrate. ### Claim 15 (depends on 9) The optical transceiver according to claim 9, wherein projections of the plurality of ground vias on the substrate are staggered with each other to define a fence structure. ### Claim 16 (depends on 9) The optical transceiver according to claim 9, wherein a part of the plurality of ground vias are located in the main region.