# US 12,604,145 B2 · Micro-electro-mechanical system microphone, microphone unit and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,604,145 B2 - Document ID: US12604145B2 - Status: Granted - Kind: B2 - Application number: 18/293,513 - Filed: 2022-07-27 - Published: 2024-10-03 - Granted: 2026-04-14 - Earliest claimed: 2021-07-30 - Assignees: Goertek Microelectronics Inc. - Applicants: Goertek Microelectronics Inc. - Inventors: Quanbo Zou; Guanxun Qiu; Zhe Wang; Qinglin Song - Web page: https://patentgrep.com/patent/US12604145B2 ## CPC - H04R 19/04: Microphones (H04R19/01 takes precedence) - B81B 3/0021: {Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00)} - H04R 1/028: {associated with devices performing functions other than acoustics, e.g. electric candles} - H04R 7/04: Plane diaphragms - H04R 7/18: at the periphery - H04R 19/005: {using semiconductor materials} - B81B 2201/0257: Microphones or microspeakers - B81B 2203/0127: Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function - B81B 2203/0307: Anchors - B81B 2203/04: Electrodes - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - H04R 2201/003: Mems transducers or their use - H04R 2410/03: Reduction of intrinsic noise in microphones - H04R 2499/11: Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A MEMS microphone, a microphone unit and an electronic device are disclosed by the present disclosure. The micro-electro-mechanical system microphone comprises: a substrate; a back electrode plate comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion used for supporting a periphery of a diaphragm, and a supporting electrode being insulated from the supported diaphragm, and wherein the diaphragm is a stress-free film when being applied no bias, and when being applied a bias, the supporting electrode constrains the periphery of the diaphragm on the supporting portion through electrostatic interaction so as to support the diaphragm in a clamped manner. ## Claims ### Claim 1 A MEMS microphone, comprising: a substrate; a back electrode plate divided into a center region and an edge region, the edge region comprising a supporting structure; and a diaphragm located between the substrate and the back electrode plate, wherein the supporting structure comprises a supporting portion for supporting a periphery of a diaphragm, and a supporting electrode insulated from the supported diaphragm, and the supporting portion comprises a plurality of supporting bulges arranged from an inner side to an outer side in the edge region, and wherein the diaphragm is configured as a stress-free film when no bias is applied, and when a bias is applied, a center and the periphery of the diaphragm are both displaced toward the back electrode plate, so that the plurality of supporting bulges support the periphery of the diaphragm, and the supporting electrode is configured to constrain the periphery of the diaphragm on the supporting portion through an electrostatic interaction to support the diaphragm in a clamped manner. ### Claim 2 (depends on 1) The MEMS microphone according to claim 1, wherein the supporting electrode is located in a gap between the supporting bulges, and the supporting bulges protrude relative to the supporting electrode. ### Claim 3 (depends on 1) The MEMS microphone according to claim 1, wherein a protruding height of the supporting bulges gradually decreases from a center of the diaphragm to a periphery of the same. ### Claim 4 (depends on 2) The MEMS microphone according to claim 2, wherein a size of the gap between the supporting bulges gradually decreases from a center of the diaphragm to a periphery thereof. ### Claim 5 (depends on 1) The MEMS microphone according to claim 1, wherein an insulating layer is coated on the supporting electrode. ### Claim 6 (depends on 1) The MEMS microphone according to claim 1, wherein the back electrode plate comprises a supporting pillar having a height and located in the center of the diaphragm, and a protruding height of the supporting pillar is greater than the height of the supporting portion. ### Claim 7 (depends on 6) The MEMS microphone according to claim 6, wherein the protruding height of the supporting pillar is such that, the diaphragm has a deflection greater than or equal to ½ of the thickness of the diaphragm when the bias is applied. ### Claim 8 (depends on 1) A microphone unit comprising: a unit housing; a MEMS microphone according to claim 1; and an integrated circuit chip, wherein the MEMS microphone and the integrated circuit chip are provided in the unit housing. ### Claim 9 (depends on 8) An electronic device comprising a microphone unit according to claim 8. ### Claim 10 (depends on 1) The MEMS microphone according to claim 1, wherein the center region of the back electrode plate is configured to protrude away from the diaphragm relative to the edge region, so that a first gap of the center region distanced from the diaphragm is larger than a second gap of the edge region distanced from the diaphragm.