# US 12,603,975 B2 · Micro LED projector

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- Number: US 12,603,975 B2
- Document ID: US12603975B2
- Status: Granted
- Kind: B2
- Application number: 18/760,003
- Filed: 2024-06-30
- Published: 2024-10-24
- Granted: 2026-04-14
- Earliest claimed: 2021-12-31
- Assignees: Jade Bird Display (Shanghai) Limited
- Applicants: Jade Bird Display (Shanghai) Limited
- Inventors: Shuai Zhang; Huiwen Xu; Jian Guo
- Web page: https://patentgrep.com/patent/US12603975B2

## CPC

- G02B 19/0061: {the light source comprising a LED}
- H04N 9/3152: {for shaping the light beam (beam shaping per se G02B27/09)}
- G02B 19/0014: {at least one surface having optical power}
- G02B 19/0019: {having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)}
- G02B 19/0066: {in the form of an LED array}
- G03B 21/14: Details
- G03B 21/20: Lamp housings
- G03B 21/2033: {LED or laser light sources}
- H04N 9/3167: {for polarizing the light beam (polarizing optical systems per se G02B27/28)}
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/858: Means for heat extraction or cooling
- H10H 29/30: Active-matrix LED displays
- H10H 29/855: Optical field-shaping means, e.g. lenses
- H10W 90/00: Package configurations
- G02B 27/30: Collimators
- G09F 9/33: being semiconductor devices, e.g. diodes
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS

## Abstract

Disclosed herein is a micro LED projector comprising: a micro LED panel and a collimator unit. The micro LED structure in the micro LED panel comprises a mesa structure and a micro lens formed above the micro mesa structure, a p type semiconductor layer, an n type semiconductor layer and a light emitting layer formed between the p type semiconductor layer and the n type semiconductor layer. The center of the micro lens is at a straight line which connects the center of the light emitting layer with the center of the collimator unit. The present disclosure decreases the volume and the weight of the micro LED projector.

## Claims

### Claim 1

A micro LED display device, comprising:
a circuit board having a first end and a second end;
a micro display panel configured on a first surface of the first end of the circuit board and electrically connected to the circuit board;
a support base formed on a second surface of the first end of the circuit board, wherein the second surface of the first end is opposite to the first surface of the first end;
a flash memory formed on a first surface of the second end of the circuit board and electrically connected to the circuit board;
a connector formed on a second surface of the second end of the circuit board, wherein the second surface of the second end is opposite to the first surface of the second end; and
a central processing unit formed between the connector and the second surface of the second end of the circuit board and electrically connected to the circuit board.

### Claim 2 (depends on 1)

The micro LED display device according to claim 1, wherein the micro display panel and the flash memory are on the same surface of the circuit board.

### Claim 3 (depends on 1)

The micro LED display device according to claim 1, wherein the support base and the connector are on the same surface of the circuit board.

### Claim 4 (depends on 1)

The micro LED display device according to claim 1, wherein an edge of the micro display panel is configured not to exceed an edge of the circuit board.

### Claim 5 (depends on 1)

The micro LED display device according to claim 1, wherein an edge of the support base is configured not to exceed an edge of the circuit board.

### Claim 6 (depends on 1)

The micro LED display device according to claim 1, wherein an edge of the flash memory is configured not to exceed an edge of the circuit board.

### Claim 7 (depends on 1)

The micro LED display device according to claim 1, wherein an edge of the connector is not to exceed an edge of the circuit board.

### Claim 8 (depends on 1)

The micro LED display device according to claim 1, wherein the central processing unit is electronically coupled to the flash memory.

### Claim 9 (depends on 1)

The micro LED display device according to claim 1, wherein the circuit board is configured to be a strip shape.

### Claim 10 (depends on 1)

The micro LED display device according to claim 1, wherein the circuit board comprises flexible material configured to withstand bending force.

### Claim 11 (depends on 1)

The micro LED display device according to claim 1, further comprising a cooling element configured to transfer heat of the micro display panel.

### Claim 12 (depends on 11)

The micro LED display device according to claim 11, wherein the cooling element is formed on a back of the support base, and between the support base and the circuit board.