# US 12,603,616 B2 · Power amplifier module with interleaved wirebonds > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,603,616 B2 - Document ID: US12603616B2 - Status: Granted - Kind: B2 - Application number: 18/377,674 - Filed: 2023-10-06 - Published: 2025-04-10 - Granted: 2026-04-14 - Earliest claimed: 2023-10-06 - Assignees: NXP USA, Inc. - Applicants: NXP USA, Inc. - Inventors: Vikas Shilimkar; Joseph Agyemang Duah; Joseph Gerard Schultz - Web page: https://patentgrep.com/patent/US12603616B2 ## CPC - H03F 1/0288: {using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers} - H03F 1/565: {using inductive elements} - H03F 3/195: in integrated circuits - H03F 3/245: {with semiconductor devices only} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H03F 2200/387: A circuit being added at the output of an amplifier to adapt the output impedance of the amplifier - H03F 2200/451: the amplifier being a radio frequency amplifier - H03F 2200/541: Transformer coupled at the output of an amplifier - H10W 44/206: {Wires} - H10W 44/234: {Arrangements for impedance matching} - H03F: AMPLIFIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A device includes a Doherty amplifier having a first amplifier die having a first output terminal, and a second amplifier die with a second output terminal. A device may include an output impedance matching network connected to an output terminal of the Doherty amplifier. A device may include an impedance inversion element connected to the second output terminal of the second amplifier die. A device may include a first wirebond array connected between the first output terminal of the first amplifier die and the output impedance matching network. A device may include a second wirebond array connected between the first output terminal of the first amplifier die and the impedance inversion element, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array. ## Claims ### Claim 1 A Doherty amplifier, comprising: a first amplifier die including a first power transistor and having a first output terminal at which a first amplified signal is generated; a second amplifier die including a second power transistor with a second output terminal at which a second amplified signal is generated; an output impedance matching network connected to an output terminal of the Doherty amplifier; an impedance inversion element connected to the second output terminal of the second amplifier die; a first wirebond array connected between the first output terminal of the first amplifier die and the output impedance matching network; and a second wirebond array connected between the first output terminal of the first amplifier die and the impedance inversion element, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array. ### Claim 2 (depends on 1) The Doherty amplifier of claim 1, wherein the output impedance matching network includes a conductive output trace and wirebonds of the first wirebond array are attached to the conductive output trace. ### Claim 3 (depends on 2) The Doherty amplifier of claim 2, wherein the conductive output trace includes a first wirebond attach area, the impedance inversion element includes a second wirebond attach area, the wirebonds of the first wirebond array are connected directly to conductive output trace in the first wirebond attach area, the wirebonds of the second wirebond array are connected directly to the impedance inversion element in the second wirebond attach area, and the second wirebond attach area is between the first output terminal of the first amplifier die and the first wirebond attach area of the conductive output trace. ### Claim 4 (depends on 1) The Doherty amplifier of claim 1, wherein the wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array so that a first wirebond of the first wirebond array is between a first wirebond of the second wirebond array and a second wirebond of the second wirebond array. ### Claim 5 (depends on 4) The Doherty amplifier of claim 4, wherein at least one of: each wirebond in the first wirebond array is between first and second wirebonds of the second wirebond array; or each wirebond in the second wirebond array is between first and second wirebonds of the first wirebond array. ### Claim 6 (depends on 1) The Doherty amplifier of claim 1, wherein the wirebonds of the first wirebond array have an electrical length resulting in a 90 degree phase shift imparted to a signal between the second output terminal of the second amplifier die and the first output terminal of the first amplifier die. ### Claim 7 (depends on 1) The Doherty amplifier of claim 1, wherein the first amplifier die and the second amplifier die comprise a peaking amplifier die and a carrier amplifier die of the Doherty amplifier, respectively. ### Claim 8 A Doherty amplifier, comprising: a first amplifier die including a first power transistor and having a first output terminal at which a first amplified signal is generated; a second amplifier die including a second power transistor with a second output terminal at which a second amplified signal is generated; an output transformer connected to an output terminal of the Doherty amplifier; a shunt inductance network; an impedance inversion element; a first wirebond array connected between the first output terminal of the first amplifier die and the output transformer; a second wirebond array connected between the second output terminal of the second amplifier die and the impedance inversion element; and a third wirebond array connected between the second output terminal of the second amplifier die the shunt inductance network, wherein wirebonds of the second wirebond array are interleaved with wirebonds of the third wirebond array. ### Claim 9 (depends on 8) The Doherty amplifier of claim 8, wherein the impedance inversion element includes a first wirebond attach area, the shunt inductance network includes a first conductive trace having a second wirebond attach area, wirebonds of the second wirebond array are connected directly to impedance inversion element in the first wirebond attach area, wirebonds of the third wirebond array are connected directly to the second wirebond attach area of the first conductive trace, and the first wirebond attach area is between the second output terminal of the second amplifier die and the second wirebond attach area. ### Claim 10 (depends on 8) The Doherty amplifier of claim 8, wherein the wirebonds of the second wirebond array are interleaved with wirebonds of the third wirebond array so that a first wirebond of the second wirebond array is between a first wirebond of the third wirebond array and a second wirebond of the third wirebond array. ### Claim 11 (depends on 10) The Doherty amplifier of claim 10, wherein at least one of: each wirebond in the second wirebond array is between pairs of wirebonds of the third wirebond array; or each wirebond in the third wirebond array is between pairs of wirebonds of the second wirebond array. ### Claim 12 (depends on 8) The Doherty amplifier of claim 8, wherein the first amplifier die and the second amplifier die comprise a peaking amplifier die and a carrier amplifier die of the Doherty amplifier, respectively. ### Claim 13 An amplifier, comprising: a substrate; a first amplifier die on the substrate, the first amplifier die including a first power transistor and having a first output terminal at which a first amplified signal is generated; a second amplifier die on the substrate, the second amplifier die including a second power transistor with a second output terminal at which a second amplified signal is generated; a first electrical component on the substrate, the first electrical component including a first wirebond attach area; a second electrical component on the substrate, the second electrical component including a second wirebond attach area; a first wirebond array connected between the first output terminal of the first amplifier die and the first wirebond attach area; and a second wirebond array connected between the first output terminal of the first amplifier die and the second wirebond attach area, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array. ### Claim 14 (depends on 13) The amplifier of claim 13, wherein the wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array so that a first wirebond of the first wirebond array is between a first wirebond of the second wirebond array and a second wirebond of the second wirebond array. ### Claim 15 (depends on 14) The amplifier of claim 14, wherein at least one of: each wirebond in the first wirebond array is between wirebonds of the second wirebond array; or each wirebond in the second wirebond array is between wirebonds of the first wirebond array. ### Claim 16 (depends on 13) The amplifier of claim 13, wherein the first electrical component includes an output transformer connected to an output terminal of the amplifier. ### Claim 17 (depends on 13) The amplifier of claim 13, where the first electrical component includes a shunt inductance. ### Claim 18 (depends on 17) The amplifier of claim 17, wherein the second electrical component includes an impedance inversion element. ### Claim 19 (depends on 18) The amplifier of claim 18, wherein the impedance inversion element includes the second wirebond attach area and the second wirebond attach area is between first output terminal of the first amplifier die and the first wirebond attach area. ### Claim 20 (depends on 13) The amplifier of claim 13, wherein the first amplifier die and the second amplifier die comprise a peaking amplifier die and a carrier amplifier die of a Doherty amplifier, respectively.