# US 12,603,256 B2 · Conductive member for cleaning focus ring of a plasma processing apparatus

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- Number: US 12,603,256 B2
- Document ID: US12603256B2
- Status: Granted
- Kind: B2
- Application number: 17/563,560
- Filed: 2021-12-28
- Published: 2023-03-09
- Granted: 2026-04-14
- Earliest claimed: 2021-12-28
- Assignees: Beijing E-Town Semiconductor Technology Co., Ltd.; Mattson Technology, Inc.
- Applicants: Beijing E-Town Semiconductor Technology Co., Ltd.; Mattson Technology, Inc.
- Inventors: Maolin Long; Changle Guan
- Web page: https://patentgrep.com/patent/US12603256B2

## CPC

- H01J 37/32642: {Focus rings}
- H01J 37/32715: {Workpiece holder}
- H10P 72/72: using electrostatic chucks
- H10P 72/722: {Details of electrostatic chucks}
- H10P 72/7611: {characterised by edge profile or support profile}
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A pedestal assembly is provided. The pedestal assembly includes an electrostatic chuck configured to support a workpiece. The pedestal assembly includes a focus ring have a top surface and a bottom surface. The focus ring can be configured to surround a periphery of the workpiece when the workpiece is positioned on the electrostatic chuck. The pedestal assembly includes a plurality of insulators. The pedestal assembly further includes a conductive member positioned between at least a portion of the bottom surface of the focus ring and at least a portion of one of the plurality of insulators.

## Claims

### Claim 1

A pedestal assembly comprising:
an electrostatic chuck configured to support a workpiece, the electrostatic chuck defining a plurality of stepped surfaces, each of the plurality of stepped surfaces comprises a different horizontal depth;
a focus ring having a top surface and a bottom surface, the focus ring configured to surround a periphery of the workpiece when the workpiece is positioned on the electrostatic chuck;
an inner insulator ring configured to surround a portion of a periphery of the electrostatic chuck;
an outer insulator ring configured to surround a periphery of the inner insulator ring, the electrostatic chuck, and a conductive member, the focus ring being on the outer insulator ring such that the bottom surface of the focus ring is on a top surface of the outer insulator ring; and
the conductive member positioned vertically between at least a portion of the bottom surface of the focus ring, a top surface of the inner insulator ring, and positioned horizontally between a portion of the inner insulator ring and the outer insulator ring, the conductive member is spaced apart from the periphery of the electrostatic chuck along a first axis by a first distance and the conductive member is spaced apart from the periphery of the electrostatic chuck along a second axis by a second distance, the first axis intersecting with the second axis in a plane, and the first axis and the second axis forming an angle that differs from 90 degrees by less than 15 degrees.

### Claim 2 (depends on 1)

The pedestal assembly of claim 1, wherein the conductive member comprises a semiconductor material.

### Claim 3 (depends on 1)

The pedestal assembly of claim 1, wherein the conductive member comprises a metal.

### Claim 4 (depends on 1)

The pedestal assembly of claim 1, wherein the first distance is different than the second distance.

### Claim 5 (depends on 1)

The pedestal assembly of claim 1, wherein the first distance ranges from about 2 millimeters to about 5 millimeters.

### Claim 6 (depends on 1)

The pedestal assembly of claim 1, wherein the conductive member comprises a conductive ring.

### Claim 7 (depends on 1)

The pedestal assembly of claim 1, wherein the inner insulator ring comprises:
a first portion positioned on a first stepped surface of the plurality of stepped surfaces; and
a second portion positioned on a second stepped surface of the plurality of stepped surfaces.

### Claim 8 (depends on 1)

The pedestal assembly of claim 1, wherein the conductive member is positioned between the stepped surface defined by the inner insulator ring and a first portion of the bottom surface of the focus ring.

### Claim 9 (depends on 8)

The pedestal assembly of claim 8, wherein:
the conductive member is spaced apart from the periphery of the electrostatic chuck along a first axis by a first distance; and
the conductive member is spaced apart from the periphery of the electrostatic chuck along a second axis by a second distance, the second axis being substantially perpendicular to the first axis.

### Claim 10 (depends on 9)

The pedestal assembly of claim 9, wherein the first distance is different than the second distance.

### Claim 11

A plasma processing apparatus comprising:
a processing chamber; and
a pedestal assembly disposed within the processing chamber, the pedestal assembly comprising:
an electrostatic chuck configured to support a workpiece, the electrostatic chuck defining a plurality of stepped surfaces, each of the plurality of stepped surfaces comprises a different horizontal depth;
a focus ring having a top surface and a bottom surface, the focus ring configured to surround a periphery of the workpiece when the workpiece is positioned on the electrostatic chuck;
an inner insulator ring configured to surround a portion of a periphery of the electrostatic chuck;
an outer insulator ring configured to surround a periphery of the inner insulator ring, the electrostatic chuck, and a conductive member, the focus ring being on the outer insulator ring such that the bottom surface of the focus ring is on a top surface of the outer insulator ring; and
the conductive member positioned vertically between at least a portion of the bottom surface of the focus ring, a top surface of the inner insulator ring, and positioned horizontally between a portion of the inner insulator ring and the outer insulator ring, the conductive member is spaced apart from the periphery of the electrostatic chuck along a first axis by a first distance and the conductive member is spaced apart from the periphery of the electrostatic chuck along a second axis by a second distance, the first axis intersecting with the second axis in a plane, and the first axis and the second axis forming an angle that differs from 90 degrees by less than 15 degrees.

### Claim 12 (depends on 11)

The plasma processing apparatus of claim 11, wherein the conductive member comprises a conductive ring.
