Electronic component and method for manufacturing the same
AssigneeMurata Manufacturing Co., Ltd.
InventorHirofumi Oie
Life of this patent
Estimating the term…
Abstract
To provide electronic component in which bonding strength between external electrode and plating layer and bonding strength between external electrode and internal conductor can be increased. Electronic component according to present disclosure includes element body, interlayer connection conductor provided inside element body so as to extend to main surface of element body, external electrode formed on main surface of element body so as to cover interlayer connection conductor, and plating layer covering external electrode. Plating layer includes impregnation part that is impregnated into interlayer connection conductor.
Claims13
An electronic component comprising:
- an element body;
- an internal conductor provided inside the element body so as to extend to an outer surface of the element body;
- an external electrode provided on the outer surface of the element body so as to cover at least a part of the internal conductor;
- and
- a plating layer covering at least a part of the external electrode, wherein
- the plating layer comprises an impregnation part impregnated into the internal conductor, wherein
- the external electrode is impregnated with the impregnation part, and wherein
- a boundary part of the internal conductor with the plating layer is impregnated with the impregnation part at a higher density than a boundary part of the external electrode with the plating layer.
An electronic component comprising:
- an element body;
- an internal conductor provided inside the element body so as to extend to an outer surface of the element body;
- an external electrode provided on the outer surface of the element body so as to cover at least a part of the internal conductor;
- and
- a plating layer covering at least a part of the external electrode, wherein
- the plating layer comprises an impregnation part impregnated into the internal conductor, wherein
- the external electrode is impregnated with the impregnation part, wherein
- the external electrode and the internal conductor comprise a first part overlapping the internal conductor when viewed from a direction orthogonal to the outer surface of the element body and a second part not overlapping the internal conductor when viewed from the direction orthogonal to the outer surface of the element body, and wherein
- a boundary part of the first part with the plating layer is impregnated with the impregnation part at a higher density than a boundary part of the second part with the plating layer.
Dependencies are inferred from the claim text.