Power modules with elevated inductors and capacitors arranged under the inductors

An apparatus comprising:

• a printed circuit board (PCB) comprising a first PCB surface and a second PCB surface opposite the first PCB surface;
• one or more integrated circuits (ICs) attached to the first PCB surface;
• and
• one or more power modules attached to the second PCB surface, wherein each power module comprises:
• an interposer board (IB) comprising:
• a first IB surface and a second IB surface opposite the first surface;
• one or more inductors mounted on the first IB surface, wherein:
• each of the one or more inductors comprises a top surface and a bottom surface opposite the top surface and that faces the first IB surface;
• and
• each of the one or more inductors is elevated above the first IB surface such that at least a portion of the bottom surface of the inductor does not contact the first IB surface;
• and
• for each of the one or more inductors, the interposer board comprises a plurality of capacitors arranged in an area below the portion of the bottom surface of the inductor that does not contact the first IB surface,
• wherein at least one of the one or more inductors comprise a dual-fed bridge coupled inductor comprising a plurality of inductor core posts that electrically connect the inductor to conductors of the IB and support the inductor on the first IB surface.