# US 12,603,192 B2 · Conductive resin composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,603,192 B2 - Document ID: US12603192B2 - Status: Granted - Kind: B2 - Application number: 17/922,585 - Filed: 2021-04-23 - Published: 2023-06-01 - Granted: 2026-04-14 - Earliest claimed: 2020-05-01 - Assignees: Shoei Chemical Inc. - Applicants: Shoei Chemical Inc. - Inventors: Soichiro Esaki - Web page: https://patentgrep.com/patent/US12603192B2 ## CPC - H01B 1/04: mainly consisting of carbon-silicon compounds, carbon or silicon - H01B 1/22: the conductive material comprising metals or alloys - H01G 4/2325: {characterised by the material of the terminals} - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 9/042: characterised by the material (H01G11/22 takes precedence) - H01G 9/048: characterised by their structure (H01G11/22 takes precedence) - C08G 77/14: containing silicon bound to oxygen-containing groups - C08G 77/16: to hydroxy groups - C08K 3/08: Metals - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance. ## Claims ### Claim 1 A conductive resin composition, comprising a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin, wherein the silicone resin is a thermosetting silicone resin, wherein the thermosetting silicone resin has a hydroxy group and an epoxy group, and is cured by heating without using a curing agent, and a content of the resin binder is 2.5 to 35.0 parts by mass with respect to 100.0 parts by mass of the metal powder; and wherein when 1% strain is applied to the conductive resin composition at an angular frequency of 1 Hz, a value of a phase difference δ between the strain and a stress caused by the strain is in a range of 32 to 87° and/or a ratio of a viscosity of the conductive resin composition at a shear rate of 0.4 (1/s) to a viscosity thereof at a shear rate of 40 (1/s) is in a range of 1.5 to 60.0. ### Claim 2 (depends on 1) The conductive resin composition according to claim 1, wherein the silicone resin is cured through a dehydration reaction upon heating. ### Claim 3 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0. ### Claim 4 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM). ### Claim 5 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 6 (depends on 1) The conductive resin composition according to claim 1, wherein the metal powder is at least one or more powders selected from: one or more powders of silver, copper, nickel, palladium, platinum, gold, and aluminum; a powder containing an alloy of one or more of these metals; a silver-coated copper powder; and a silver-coated nickel powder. ### Claim 7 (depends on 1) The conductive resin composition according to claim 1, wherein the metal powder is a powder containing silver and/or copper. ### Claim 8 (depends on 1) The conductive resin composition according to claim 1, which is for forming an external electrode of a multilayer electronic component or a cathode of a solid electrolytic capacitor. ### Claim 9 (depends on 1) The conductive resin composition according to claim 1, wherein: the content of the resin binder is 5.0 to 25.0 parts by mass with respect to 100.0 parts by mass of the metal powder; 80.0% by mass or more of the resin binder is a silicone resin; when the 1% strain is applied to the conductive resin composition at the angular frequency of 1 Hz, the value of a phase difference δ between the strain and the stress caused by the strain is in a range of 45 to 87°; and the ratio of a viscosity of the conductive resin composition at a shear rate of 0.4 (1/s) to a viscosity thereof at a shear rate of 40 (1/s) is in a range of 1.5 to 20.0. ### Claim 10 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0, the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM), and the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 11 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0, the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM), and the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 12 (depends on 1) The conductive resin composition according to claim 1, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0, the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM), and the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 13 (depends on 6) The conductive resin composition according to claim 6, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0, the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM), and the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 14 (depends on 2) The conductive resin composition according to claim 2, wherein the flaky metal powder has an aspect ratio of 1.5 to 50.0, the flaky metal powder has a number average particle diameter of 0.1 to 20.0 μm as measured using a scanning electron microscope (SEM), and the flaky metal powder has a specific surface area of 0.5 to 5.0 m2/g. ### Claim 15 (depends on 1) The conductive resin composition according to claim 1, wherein a moisture permeation amount is 80.0 mg or less as determined in a moisture permeation amount measurement test by: casting the conductive resin composition on a PET film to a thickness of 250 μm and curing the conductive resin composition at 200° C. for 60 minutes to form a cured film; cutting the cured film into a circle of 7.5 mm in diameter and fixing the circle with an adhesive so as to cover a 5 ml glass bottle containing 2 g of silica gel; placing the glass bottle in a 750 ml vessel containing 100 ml of purified water so that the cured film does not come into contact with the purified water; sealing the vessel and placing the vessel in a dryer at 65° C. for 15 hours; and calculating the moisture permeation amount by the following equation (1): moisture permeation amount (weight increase)=weight of the glass bottle after being placed in the dryer−weight of the glass bottle before being placed in the dryer (1).