# US 12,602,771 B2 · In situ wafer seal chuck defects identification > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,602,771 B2 - Document ID: US12602771B2 - Status: Granted - Kind: B2 - Application number: 18/647,598 - Filed: 2024-04-26 - Published: 2025-10-30 - Granted: 2026-04-14 - Earliest claimed: 2024-04-26 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Gangadhar Sheelavant; Karthick Vasu; Prabhugouda Shekharagouda Hiregoudra; Randy A Harris; Aaron Juntunen - Web page: https://patentgrep.com/patent/US12602771B2 ## CPC - G06T 7/001: {using an image reference approach} - G01M 3/38: by using light (G01M3/02 takes precedence) - H04N 23/11: for generating image signals from visible and infrared light wavelengths - G06T 2207/10048: Infrared image - G06T 2207/20081: Training; Learning - G06T 2207/30148: Semiconductor; IC; Wafer - G08B 21/18: Status alarms (G08B21/02 takes precedence) - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - G01M: TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - G08B: SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS ## Abstract Exemplary wafer seal chuck assembly maintenance chambers may include a chamber body defining an open interior. The chambers may include a plurality of chuck assembly supports disposed within the open interior. The plurality of chuck assembly supports may be rotatable within the open interior. The chambers may include a tool arm that is positionable above the open interior. The chambers may include an imaging device mounted on a distal end of the tool arm. ## Claims ### Claim 1 A wafer seal chuck assembly maintenance chamber, comprising: a chamber body defining an open interior; a plurality of chuck assembly supports disposed within the open interior, the plurality of chuck assembly supports being rotatable within the open interior; a tool arm that is positionable above the open interior; and an imaging device mounted on a distal end of the tool arm. ### Claim 2 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: the imaging device comprises a visible light camera. ### Claim 3 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: the imaging device comprises one both of an infrared camera and an ultraviolet camera. ### Claim 4 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: the tool arm is movable between a first position in which an entirety of the tool arm and the imaging device are located radially outward of the open interior and a second position in which the imaging device and the distal end of the tool arm are positioned directly above the open interior. ### Claim 5 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: the imaging device comprises a field of view of at least 10 degrees. ### Claim 6 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: an orientation of the imaging device is adjustable relative to the distal end of the tool arm. ### Claim 7 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, further comprising: a seal rinse assembly that is positionable over the open interior. ### Claim 8 (depends on 7) The wafer seal chuck assembly maintenance chamber of claim 7, wherein: the seal rinse assembly is coupled with the distal end of the tool arm. ### Claim 9 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: the plurality of chuck supports are configured to receive and support a wafer seal chuck assembly. ### Claim 10 (depends on 1) The wafer seal chuck assembly maintenance chamber of claim 1, wherein: a lens of the imaging device is directed radially outward from a central axis of the open interior. ### Claim 11 A wafer seal chuck assembly maintenance chamber, comprising: a chamber body defining an open interior; a plurality of chuck assembly supports disposed within the open interior, the plurality of chuck assembly supports being rotatable within the open interior; an imaging device that is positionable above the open interior; and a seal rinse assembly that is positionable over the open interior. ### Claim 12 (depends on 11) The wafer seal chuck assembly of claim 11, further comprising: a tool arm that is movable between a first position in which an entirety of the tool arm is located radially outward of the open interior and a second position in which a distal end of the tool arm is positioned directly above the open interior, wherein the imaging device and the seal rinse assembly are coupled with the distal end of the tool arm. ### Claim 13 (depends on 11) The wafer seal chuck assembly of claim 11, further comprising: a first tool arm that is positionable over the open interior; and a second tool arm that is positionable over the open interior, wherein: the imaging device is coupled with a distal end of the first tool arm; the seal rinse assembly is coupled with a distal end of the second tool arm; and the first tool arm and the second tool arm are positionable independently of one another. ### Claim 14 (depends on 11) The wafer seal chuck assembly of claim 11, further comprising: one or more processors; and a memory having instructions stored thereon that, when executed by the one or more processors, cause the one or more processors to: receive an image of a wafer seal chuck assembly from the imaging device; perform one or more digital image processing operations on the image; and identify at least one defect associated with the wafer seal chuck assembly based on the one or more digital image processing operations. ### Claim 15 A method of inspecting a wafer seal chuck assembly, comprising: capturing an image of a wafer seal chuck assembly using an imaging device positioned above an open interior of a maintenance chamber; performing one or more digital image processing operations on the image; and identifying at least one defect associated with the wafer seal chuck assembly based on the one or more digital image processing operations, wherein the at least one defect comprises at least one of seal lip metal plate up, seal elastomer damage, seal retainer metal plate up, backing plate burnout, a missing clip from a backing plate, metal plate up on an electrical contact, a missing contact from an electrical contact, or a misaligned contact from an electrical contact. ### Claim 16 (depends on 15) The method of inspecting a wafer seal chuck assembly of claim 15, wherein: performing one or more digital image processing operations on the image comprises comparing the image to a baseline image of a new wafer seal chuck assembly and identifying any differences between the image and the baseline image. ### Claim 17 (depends on 15) The method of inspecting a wafer seal chuck assembly of claim 15, wherein: performing one or more digital image processing operations on the image comprises providing the image to a machine learning model that has been trained to identify defects of wafer seal chuck assemblies based on images of defective wafer seal chuck assemblies; and identifying the at least one defect associated with the wafer seal chuck assembly is performed by the machine learning model. ### Claim 18 (depends on 15) The method of inspecting a wafer seal chuck assembly of claim 15, further comprising: generating an alert for an operator upon identifying the at least one defect associated with the wafer seal chuck assembly. ### Claim 19 (depends on 15) The method of inspecting a wafer seal chuck assembly of claim 15, further comprising: rinsing the wafer seal chuck assembly after identifying the at least one defect associated with the wafer seal chuck assembly.