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US 12,602,564 B2Granted
Biometric smartcard module
AssigneeSmart Packaging Solutions
InventorRobert Mueller
Life of this patent
Estimating the term…
Abstract
An integrated circuit module is provided for post-lamination implanting into a smartcard body. The integrated circuit module includes a contact plate, a biometric sensor, a secure element, and means for electrical connection to an antenna embedded within the smartcard body. The secure element includes contact and contactless communication logic, and is configured to perform at least one smartcard function utilising the biometric sensor.
Claims16
An integrated circuit (IC) module for post-lamination implanting into a smartcard body, the module comprising:
- a secure element configured to perform at least one smartcard function, the secure element comprising contactless interface logic and contact interface logic;
- a contact plate defining a plurality of external contact pads configured to be exposed when the module has been implanted in the smartcard body, the contact plate being in communication with the secure element;
- and
- a biometric sensor comprising a sensor surface configured to be exposed when the module has been implanted in the smartcard body, the biometric sensor being in communication with the secure element;
- wherein the IC module is intended for use in a System-on-Card smartcard so as not to transmit the biometric reference data off of the smartcard.
2 more elements
Dependencies are inferred from the claim text.