# US 12,602,086 B2 · Electronic device and method for manufacturing the same

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- Number: US 12,602,086 B2
- Document ID: US12602086B2
- Status: Granted
- Kind: B2
- Application number: 18/460,023
- Filed: 2023-09-01
- Published: 2024-03-07
- Granted: 2026-04-14
- Earliest claimed: 2022-09-05
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Kyung-Man Kim; Sunghoon Kim; Sanghoon Kim; Min-Hoon Choi; Seongjin Hwang
- Web page: https://patentgrep.com/patent/US12602086B2

## CPC

- G06F 1/1656: {Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203)}
- G06F 1/1626: {with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]}
- G06F 1/1637: {Details related to the display arrangement, including those related to the mounting of the display in the housing}
- G06F 1/1684: {Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675}
- G06F 1/1686: {the I/O peripheral being an integrated camera}
- G06F 1/1688: {the I/O peripheral being integrated loudspeakers}
- H04M 1/0266: {for a display module assembly}
- H04M 1/0269: {mounted in a fixed curved configuration, e.g. display curved around the edges of the telephone housing}
- H04M 1/0283: {for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08)

## Abstract

An electronic device and a method for manufacturing the same are provided. An electronic device includes a window including a first region parallel to a flat surface that is defined by a first direction and a second direction crossing the first direction and a second region extending from the first region and including a curved surface, a display module under the window, and an electronic module under the window and overlapping the second region, and the second region includes an edge of the window, and at least one hole is defined in the second region.

## Claims

### Claim 1

A method for manufacturing an electronic device, the method comprising:
providing a glass substrate including a first region, and a second region outside the first region and including an edge of the glass substrate;
modifying a region of the glass substrate by irradiating a partial region of the second region with a beam;
etching the modified region of the glass substrate to form a curved surface and a hole in the modified region of the glass substrate; and
attaching a display module to the glass substrate,
wherein, in the modifying the region of the glass substrate, the partial region includes a curved surface region in which the curved surface is to be formed and a hole region in which the hole is to be formed,
in the curved region, a depth of a region modified by the beam increases toward the edge of the glass substrate, and
in the hole region, a depth of a region modified by the beam is greater than that of the curved region.

### Claim 2 (depends on 1)

The method of claim 1, wherein, in the etching, the modified region has a higher etch selectivity than a remaining region that is not modified.

### Claim 3 (depends on 1)

The method of claim 1, wherein, after the etching, in the curved region, a thickness of the glass substrate becomes thinner in a direction toward the edge and a curvature of the curved surface increases in the direction toward the edge.

### Claim 4 (depends on 1)

The method of claim 1, wherein, in the modifying of the glass substrate, in the hole region, the hole is modified to a depth corresponding to a thickness of the glass substrate such that the hole penetrates the glass substrate.

### Claim 5 (depends on 4)

The method of claim 4, wherein a through-hole formed in the hole region by the etching has a diameter that increases from a center of the through-hole toward a normal line direction of the glass substrate.

### Claim 6 (depends on 1)

The method of claim 1, wherein the beam is a Bessel beam emitted from an ultra-short pulse laser.