# US 12,601,707 B2 · Symmetric structural type oxygen sensor chip and manufacturing method thereof

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- Number: US 12,601,707 B2
- Document ID: US12601707B2
- Status: Granted
- Kind: B2
- Application number: 18/600,436
- Filed: 2024-03-08
- Published: 2025-04-17
- Granted: 2026-04-14
- Earliest claimed: 2023-10-11
- Assignees: Suzhou Industrial Park Futes Automotive Electronics Co., Ltd
- Applicants: Suzhou Industrial Park Futes Automotive Electronics Co., Ltd
- Inventors: Ronglang Chen; Loufu Luo; Shikang Feng
- Web page: https://patentgrep.com/patent/US12601707B2

## CPC

- G01N 27/409: Oxygen concentration cells
- G01N 27/4071: {using sensor elements of laminated structure}
- G01N 33/0036: {specially adapted to detect a particular component (physical analysis of gaseous biological material G01N33/497)}
- Y02T 10/40: Engine management systems
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- Y02T: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION

## Abstract

Disclosed are a symmetric structural type oxygen sensor chip and its manufacturing method. The chip comprises a substrate layer, an insulating layer, and a heater layer; the substrate layer and the insulating layer constitute a tightly combined symmetrical structure with the heater layer as the axis of symmetry, no matter in the stress release during the sintering and forming process, or in the thermal expansion and contraction stress release during the subsequent use process, a relatively symmetrical and uniform stress release can be formed, the warpage of the chip is greatly improved, and the deformation of the chip can be basically controlled within 0.1 mm, which greatly reduces the chipping phenomenon during the assembly process, and can also reduce the cracking phenomenon during the use process.

## Claims

### Claim 1

A symmetric structural type oxygen sensor chip, comprising:
a substrate layer, an insulating layer, and a heater layer; wherein
the substrate layer and the insulating layer take the position of the heater layer as a symmetry axis to form a tightly combined symmetry structure, encapsulating the heater layer in a middle;
the substrate layer comprises four layers, from top to bottom, a first substrate layer, a second substrate layer, a third substrate layer, and a fourth substrate layer;
the insulating layer comprises an upper insulating layer and a lower insulating layer, both of which are disposed between the second substrate layer and the third substrate layer;
the heater layer is disposed between the upper insulating layer and the lower insulating layer;
an air passage layer is disposed above the second substrate layer, an outer electrode layer is disposed on a upper surface of the first substrate layer, an inner electrode layer is disposed between the first substrate layer and the second substrate layer, a protective layer for isolating gas and protecting the outer electrode layer is disposed on a top of the outer electrode layer, a first insulating layer is disposed between the first substrate layer and the outer electrode layer, a end lead is disposed on an outer side of the fourth substrate layer, and a second insulating layer is disposed between the end lead and the fourth substrate layer;
the substrate layer is a zirconia film containing mullite and alumina, the zirconia film is pressed from zirconia slip, wherein the zirconia slip contains alumina with a volume content of 5% and mullite with a volume content of 10%; and
the insulating layer is an alumina insulating layer.

### Claim 2 (depends on 1)

The symmetric structural type oxygen sensor chip according to claim 1, wherein
the inner electrode layer and the outer electrode layer are platinum electrode plates.

### Claim 3 (depends on 2)

A method for manufacturing a symmetric structural type oxygen sensor chip according to claim 2, comprising:
S1, preparing a zirconia slurry and a printing slurry;
S2, using an automatic casting machine to press the zirconia slurry into a zirconia film, and laminating to 10-150 microns;
S3, using a laminating machine to laminate the zirconia film slipped out into a zirconia film of the required thickness, and then performing hot pressing and drying;
S4, punching the dried zirconia film;
S5, using the printing paste to print various functional layers on the punched zirconia film, comprising the air passage layer, the second insulating layer, the first insulating layer, the protective layer, the upper insulating layer, the lower insulating layer, the outer electrode layer, the inner electrode layer, the heater layer, and the end lead;
S6, laminating the dried zirconia film in sequence, then vacuum packaging it, and sending it to isostatic pressing, the temperature is set to 50±2° C., and the time is set to 20 minutes;
S7, chamfering and cutting the film; and
S8, sending the formed film into a sintering furnace for sintering and forming, the temperature is 1400° C., and the oxygen sensor chip is obtained after completion.

### Claim 4 (depends on 3)

The method according to claim 3, wherein
the zirconia slip is composed of nano-grade yttria stabilized zirconia slip powder, and auxiliary materials, the auxiliary materials comprise a dispersant, an organic solvent, a binder, and an adhesive.

### Claim 5 (depends on 4)

The method according to claim 4, wherein
the zirconia slip comprises 50-60% of 5 mol yttria stabilized zirconia slip powder, 20-30% of dispersant and organic solvent, 10-15% of binder, and 20-25% of adhesive.

### Claim 6 (depends on 5)

The method according to claim 5, wherein:
the organic solvent comprises one or a combination of more of polyvinyl alcohol, polyethylene glycol, polyacrylic acid, camphor, stearic acid, and glycerol; the dispersant is one or or a combination of more of fish oil, castor oil, triethanolamine, and polyacrylic acid; the binder is one or several combinations of melamine resin and acrylic resin.