US 12,601,666 B1Granted

Test sample for measuring adhesive strength under tension

AssigneeThe United States of America as represented by the Secretary of the Navy

InventorsThomas S Ramotowski, Anthony S Poirier, Eric A Warner

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Abstract

A test sample is provided for measuring tensile strength of an adhesive bond between two identical substrates. Each identical substrate has first and second identical ends. An end from one substrate is aligned with an end from the other substrate so that they completely overlap and abut each other. Adhesive is applied to the abutting ends. An alignment fixture aligns the substrates while the adhesive cures. Each substrate includes through holes for mounting to a test machine without the use of special grips. After a test sample has been tested to failure, a new test sample can be quickly made by reversing the orientation of the substrates by 180 degrees and using their opposite ends to make a new test sample. After both ends of a substrate have been used for testing, both ends can be cleaned and the substrates reused for new test samples.

Claims12

Dependent claims

A test sample for measuring tensile strength of an adhesive bond comprising:

a first bilaterally symmetric substrate having a central longitudinal axis and first and second ends wherein said first and second ends are planes that are normal to said central longitudinal axis and said first and second ends define a same cross-sectional shape and area, the first and second ends each having a through hole formed therein at a uniform distance from the respective first and second end, the first end through hole and the second end through hole having center lines that are parallel to each other;
and
a second bilaterally symmetric substrate having a central longitudinal axis and first and second ends wherein said first and second ends are defined by planes that are normal to said central longitudinal axis and said first and second ends define a same cross-sectional shape and area as said first and second ends of said first bilaterally symmetric substrate, the first and second ends each having a through hole formed therein at a uniform distance from the respective first and second end, the first end through hole and the second end through hole having center lines that are parallel to each other;
wherein said first and second bilaterally symmetric substrates each including at least a portion having at least one flat side;
wherein said first and second ends of said first bilaterally symmetric substrate and said first and second ends of said second bilaterally symmetric substrate support the adhesive bond for testing;
and
wherein adhesive bond testing can be performed utilizing each said first and second end of said first bilaterally symmetric substrate and each said first and second end of said second bilaterally symmetric substrate.

4 more elements

A method for making a test sample to measure tensile strength of an adhesive bond between two substrates, the method comprising:

providing first and second identical bilaterally symmetrical substrates, each bilaterally symmetric substrate having a central longitudinal axis and first and second ends wherein said first and second ends are defined by planes that are normal to said central longitudinal axis and said first and second ends define a same cross-sectional shape and area, each said identical bilaterally symmetric substrate including opposed end portions wherein each said opposed end portion defines a through hole and wherein center lines of said through holes are parallel and equidistant respectively from said first and second ends for precise alignment of said substrates on a testing machine, and at least a portion of each said identical bilaterally symmetric substrate has at least one flat side;
applying adhesive to one of said first and second identical bilaterally symmetric substrates at the first end;
aligning said first and second identical bilaterally symmetric substrates such that the bilaterally symmetric substrate having the adhesive completely overlaps and abuts the first end of the other of said bilaterally symmetric substrates;
curing the adhesive between said first and second identical bilaterally symmetric substrates;
and
further comprising the steps of:
mounting the cured adhesive and said first and second identical bilaterally symmetric substrates combination on a testing machine;
testing the cured adhesive and said first and second identical bilaterally symmetric substrates combination on the testing machine until failure of the cured adhesive;
applying adhesive to at least one of said first and second identical bilaterally symmetric substrates at the second end;
aligning said first and second identical bilaterally symmetric substrates such that the bilaterally symmetric substrate having the adhesive completely overlaps and abuts the second end of the other of said bilaterally symmetric substrates;
curing the adhesive between the second ends of said first and second identical bilaterally symmetric substrates;
mounting said first and second identical bilaterally symmetric substrates and second end adhesive combination on a testing machine;
and
testing the cured adhesive between the second ends of said first and second identical bilaterally symmetric substrates combination on the testing machine until failure of the cured adhesive.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/879,087Filed 2 Aug 2022
Granted: 14 Apr 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G01N 3/24
Investigating strength properties of solid materials by application of mechanical stress: by applying steady shearing forces
G01N 3/08
Investigating strength properties of solid materials by application of mechanical stress: by applying steady tensile or compressive forces
G01N 19/04
Investigating materials by mechanical methods: measuring adhesive force between materials, e.g. of sealing tape, of coating
G01N 2203/0091
Kind of property studied: peeling or tearing