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US 12,601,636 B2Granted
Infrared sensor device
AssigneeMitsubishi Electric Corporation
InventorsYoshinori Takahashi, Tomohiro Maegawa
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Abstract
A sensor chip (4) having a pixel unit (8) that detects an infrared ray is bonded to an insulating substrate (2) using a bonding material (3). A heat generation mechanism (11) is integrated with the sensor chip (4). A control unit (14) is provided on the insulating substrate (2) and controls an amount of current to be supplied to the heat generation mechanism (11).
Claims9
An infrared sensor device comprising:
- an insulating substrate;
- a sensor chip bonded to the insulating substrate using a bonding material and having a pixel unit that detects an infrared ray;
- a heat generation mechanism integrated with the sensor chip;
- and
- a control unit provided on the insulating substrate and controlling an amount of current to be supplied to the heat generation mechanism,
- wherein the heat generation mechanism is a diode,
- a plurality of the heat generation mechanisms are arranged around the pixel unit in a surface of the sensor chip,
- the control unit individually controls an amount of current to be supplied to each of the plurality of heat generation mechanisms, and
- when the infrared sensor device is started up, the control unit makes an amount of current to be supplied to the heat generation mechanism arranged far from the control unit greater than an amount of current to be supplied to the heat generation mechanism arranged close to the control unit.
6 more elements
An infrared sensor device comprising:
- an insulating substrate;
- a sensor chip bonded to the insulating substrate using a bonding material and having a plurality of pixels that detect infrared rays;
- a chip temperature detector detecting temperature of the sensor chip;
- and
- a control unit provided on the insulating substrate and controlling the plurality of pixels, wherein the plurality of pixels are diodes arranged in a matrix shape,
- the control unit causes a current to flow through only the pixels in a selected column and reads out a current value of the pixel in a selected row when outputting an infrared detection result, and
- the control unit causes a current to flow through all the plurality of pixels when an output of the chip temperature detector is below a reference value.
4 more elements
Dependencies are inferred from the claim text.