# US 12,601,629 B2 · Modular monitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,601,629 B2 - Document ID: US12601629B2 - Status: Granted - Kind: B2 - Application number: 18/032,971 - Filed: 2020-10-28 - Published: 2023-12-07 - Granted: 2026-04-14 - Earliest claimed: 2020-10-28 - Assignees: Poseidon Systems, LLC - Applicants: ITT Manufacturing Enterprises LLC - Inventors: Bradley DeCook; Daniel Kernan; Naveen George; James Reitano - Web page: https://patentgrep.com/patent/US12601629B2 ## CPC - G01H 1/003: {of rotating machines (G01H1/10 takes precedence)} - G01K 1/08: Protective devices, e.g. casings - G01D 21/02: Measuring two or more variables by means not covered by a single other subclass - G01M 13/045: Acoustic or vibration analysis - G01M 99/00: Subject matter not provided for in other groups of this subclass - G01D 11/245: {Housings for sensors} - G01H 17/00: Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the other groups of this subclass - G01H: MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES - G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00) - G01D: MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR - G01M: TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR ## Abstract Technologies are described for devices to monitor a machine. The devices may comprise a battery pack module including a battery pack housing and a sensor module including a sensor module housing and a circuit board. The circuit board may include a substrate, a vibration sensor, a temperature sensor, a motor flux sensor, an ultrasonic sensor, and a processor. The vibration sensor may produce a vibration signal relating to vibration of the machine. The temperature sensor may produce a temperature signal relating to a temperature detected. The motor flux sensor may produce a motor flux signal relating to an amount of motor flux emitted by the machine. The ultrasonic sensor may produce an ultrasonic signal relating to ultrasonic waves reflected back from the machine. The processor may be in communication with the vibration sensor, the temperature sensor, the motor flux sensor, and the ultrasonic sensor. ## Claims ### Claim 1 A device to monitor a machine, the device comprising: a battery pack housing; said battery pack housing including therein a battery pack module; and a sensor module housing; said sensor module housing including therein a sensor module; said battery pack housing being configured to be attachable and removable from said sensor module housing; said sensor module including a circuit board; said circuit board including a substrate, a vibration sensor mounted on said substrate and configured to produce a vibration signal relating to vibration of the machine, a temperature sensor mounted on said substrate and configured to produce a temperature signal relating to a detected temperature, a motor flux sensor mounted on said substrate and configured to produce a motor flux signal relating to an amount of motor flux emitted by the machine, and a processor mounted on said substrate and in communication with said vibration sensor, said temperature sensor, and said motor flux sensor; said battery pack housing being configured such an interior of side walls of said battery pack housing overlaps exterior of side walls of said sensor module housing; said battery pack housing being configured to form a top for said sensor module housing and encase said side walls of said sensor module housing within said battery pack housing; said battery pack housing including slots; said sensor module housing including fasteners and an O-ring; said fasteners being integral to said sensor module housing and configured to interact with said slots to secure said battery pack housing to said sensor module housing; said O-ring being located on said exterior of said side walls of said sensor module housing such that said O-ring engages said interior of said side walls of said battery pack housing when said battery pack housing overlaps said sensor module housing. ### Claim 2 (depends on 1) The device of claim 1, further comprising: a communications module; said communications module including a communication module housing configured to be attachable and removable from the battery pack module; said communications module being in communication with said sensor module; said communications module including a communications circuit board; said communications circuit board including a communications substrate; and a cellular unit mounted on the communications substrate. ### Claim 3 (depends on 2) The device of claim 2, wherein said processor generates monitoring data based on said vibration signal, said temperature signal, and said motor flux signal. ### Claim 4 (depends on 1) The device of claim 1, wherein said sensor module further includes a communication circuit board connected to said circuit board said communication circuit board including a Bluetooth™ unit mounted on a substrate of said communication circuit board and a cellular unit mounted on said substrate of said communication circuit board. ### Claim 5 (depends on 4) The device of claim 4, wherein said processor generates monitoring data based on said vibration signal, said temperature signal, and said motor flux signal. ### Claim 6 (depends on 1) The device of claim 1, wherein said motor flux sensor detects an amount of magnetic flux emitted by the machine; said processor configured to sends data related to the amount of magnetic flux emitted by the machine to a device in communication with said processor over a network to determines a fault based on a frequency within the magnetic flux detected. ### Claim 7 (depends on 4) The device of claim 4, wherein said processor sends data to a device in communication with said processor over a network to generates motor analytics. ### Claim 8 (depends on 1) The device of claim 1 wherein said overlapping of said battery pack housing and said sensor module housing along with a seal provided by said O-ring isolates an electrical connection between said battery pack and said sensor module from an outside environment. ### Claim 9 (depends on 1) The device of claim 1 wherein said sensor module housing includes three mount feet. ### Claim 10 (depends on 1) The device of claim 1 wherein said sensor module housing includes a magnetic mount, said magnetic mount includes rare earth magnet.