Composite molded component
AssigneeSumitomo Wiring Systems, Ltd.
InventorsHironobu Yamamoto, Yukitoshi Terasaka, Kyungwoo Kim, Toshinari Kobayashi
Life of this patent
Estimating the term…
Abstract
The object of the present invention is to further improve the performance of a seal between an inner molded portion and an outer molded portion. A composite molded component includes: an internal component; an inner molded portion that covers the internal component; and an outer molded portion that covers the inner molded portion. A hole that reaches the inner molded portion is formed in the outer molded portion. A ring-shaped seal portion that surrounds the hole is provided between the inner molded portion and the outer molded portion. The ring-shaped seal portion is formed of a softer material than the inner molded portion.
Claims16
A composite molded component comprising:
- an internal component;
- an inner molded portion formed of a resin molded material, the inner molded portion covering the internal component;
- and
- an outer molded portion formed of a resin molded material, the outer molded portion covering both the inner molded portion and the internal component,
- wherein a hole that reaches the inner molded portion is formed in the outer molded portion, a ring-shaped seal portion that surrounds the hole is provided between the inner molded portion and the outer molded portion, and
- the ring-shaped seal portion is formed of a softer material than the resin molded material of the inner molded portion.
Dependencies are inferred from the claim text.