# US 12,601,050 B2 · Surface modified substrates and related methods

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- Number: US 12,601,050 B2
- Document ID: US12601050B2
- Status: Granted
- Kind: B2
- Application number: 18/785,339
- Filed: 2024-07-26
- Published: 2025-01-30
- Granted: 2026-04-14
- Earliest claimed: 2023-07-27
- Assignees: Entegris, Inc.
- Applicants: Entegris, Inc.
- Inventors: Carlo Waldfried; Surendra Maharjan; Stephen Longo
- Web page: https://patentgrep.com/patent/US12601050B2

## CPC

- C23C 16/30: Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C 8/08: only one element being applied
- C23C 16/52: Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)}
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

Surface modified substrates and related methods are provided. A substrate having a modified surface comprises a first region and a second region. The first region is located above the second region. The first region comprises a nickel fluoride. The second region comprises a nickel alloy. A concentration of the nickel fluoride gradually decreases from the first region to the second region.

## Claims

### Claim 1

A substrate comprising:
a modified surface having a first region comprising a nickel fluoride and
a second region comprising a nickel alloy,
wherein the first region is above the second region and
wherein a concentration of the nickel fluoride decreases from the first region to the second region within the modified surface of the substrate.

### Claim 2 (depends on 1)

The substrate of claim 1, wherein the substrate has an aspect ratio of 2:1 to 2000:1, wherein the aspect ratio is a ratio of two of a width, a depth, a height, a length, or a diameter.

### Claim 3 (depends on 1)

The substrate of claim 1, wherein the substrate comprises:
at least 50% by weight of nickel based on a total weight of the substrate.

### Claim 4 (depends on 1)

The substrate of claim 1, wherein the substrate comprises:
less than 10% by weight of iron based on a total weight of the substrate.

### Claim 5 (depends on 1)

The substrate of claim 1 wherein the substrate does not comprise magnesium.

### Claim 6 (depends on 1)

The substrate of claim 1, wherein the first region extends from a surface of the substrate to a depth of 2 nm to 5 μm.

### Claim 7 (depends on 1)

The substrate of claim 1, wherein the first region has a fluorine content of up to 100% as measured by XPS.

### Claim 8 (depends on 1)

The substrate of claim 1, wherein the first region has a fluorine content of 10% to 70% as measured by XPS.

### Claim 9 (depends on 1)

The substrate of claim 1, wherein the first region is resistant to thermal degradation at temperature of 200° C. to 500° C.

### Claim 10 (depends on 1)

The substrate of claim 1, wherein the first region is an outermost region of the substrate.

### Claim 11

A method comprising:
exposing a substrate to a fluorine-containing vapor sufficient to chemically modify a surface of the substrate to form a modified surface having
a first region comprising a nickel fluoride and
a second region comprising a nickel alloy,
wherein the first region is above the second region and
wherein a concentration of the nickel fluoride decreases from the first region to the second region within the substrate.

### Claim 12 (depends on 11)

The method of claim 11, wherein the substrate has an aspect ratio of 2:1 to 2000:1, wherein the aspect ratio is a ratio of two of a width, a depth, a height, a length, or a diameter.

### Claim 13 (depends on 11)

The method of claim 11, wherein the substrate comprises:
at least 50% by weight of nickel based on a total weight of the substrate; and
less than 10% by weight of iron based on the total weight of the substrate.

### Claim 14 (depends on 11)

The method of claim 11, wherein a fluorine component from the fluorine-containing vapor reacts with a nickel component of the substrate to form the first region.

### Claim 15 (depends on 11)

The method of claim 11, wherein the fluorine-containing vapor comprises at least one of CF4, C2F4, C3F6, C4F8, CHF3, C2H2F2, C2F6, HF, CH3F, or any combination thereof.

### Claim 16 (depends on 11)

The method of claim 11, wherein the fluorine-containing vapor comprises a vaporized fluorinated polymer.

### Claim 17 (depends on 16)

The method of claim 16, wherein the vaporized fluorinated polymer is derived from at least one of polymerized perfluoroalkylethylene having a C1-C10 perfluoroalkyl group, polytetrafluoroethylene (PTFE), tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer (PFA), tetrafluoroethylene/hexafluoropropylene copolymer (FEP), tetrafluoroethylene/perfluoro(alkyl vinyl ether)/hexafluoropropylene copolymer (EPA), polyhexafluoropropylene, ethylene/tetrafluoroethylene copolymer (ETFE), poly trifluoroethylene, polyvinylidene fluoride (PVDF), polyvinyl fluoride (PVF), polychlorotrifluoroethylene (PCTFE), ethylene/chlorotrifluoroethylene copolymer (ECTFE), or any combination thereof.

### Claim 18 (depends on 11)

The method of claim 11, wherein the exposing comprises heating at least a portion of the substrate at or to a temperature of 200° C. to 600° C.

### Claim 19 (depends on 11)

The method of claim 11, wherein the exposing comprises exposing the substrate to the fluorine-containing vapor for a duration of 1 millisecond to 15 hours.

### Claim 20 (depends on 11)

The method of claim 11, wherein the exposing comprises exposing the substrate to the fluorine-containing vapor at about atmospheric pressure.
