Ag- and/or Cu-containing hard coatings with antibacterial, antiviral and antifungal properties
AssigneeOerlikon Surface Solutions AG, PfäFfikon
InventorsMarie-Hélène Lindic, Noora Manninen, Canet Acikgoz Dorokin, Martin Drabik
Life of this patent
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Abstract
A substrate with a surface wherein the surface at least comprises an area which is coated with a coating having antibacterial and/or antiviral and/or antifungal properties. The coating includes an optional first layer, a second layer, and preferably a third layer, wherein the second layer is a hard layer comprising Ag and/or Cu, the optional first layer is located between the substrate body and the second layer, and the third layer is a top layer forming the outer surface of the area and which is tailored to allow Ag and/or Cu ions to leave the surface in a predetermined manner.
Claims9
A substrate comprising:
- a surface having an area which is coated with a coating with antibacterial and/or antiviral and/or antifungal properties, wherein the coating comprises an optional first layer, a second layer and a third layer,
- wherein the second layer is a hard layer composed of Ti, Zr, Nb, Cr, Al, Si, Ta or V independently or combined as alloys in metallic form or containing nitrogen, carbon, hydrogen and/or oxygen, and comprising Ag and/or Cu in metallic form,
- wherein the optional first layer is located between the surface of the substrate and the second layer,
- wherein the third layer is a top layer forming an outer surface of the coating and having a layer thickness between about 10 nm and about 400 nm and the top layer consists of TiN, and
- wherein the top layer is formed with droplets that are washed out of the top layer resulting in holes in the top layer, and the holes allow an ion-release to be facilitated.
A method for producing Ag- and/or Cu-containing hard coatings on a substrate, comprising:
- coating an area of a surface of the substrate with a coating having antibacterial and/or antiviral and/or antifungal properties, wherein the coating comprises an optional first layer, a second layer and a third layer,
- wherein in an optional first method step, the optional first layer is coated using PVD and/or CVD, coated on the surface of the substrate,
- wherein in a second method step, the second layer is coated using PVD and/or CVD, coated on the optional first layer or on the surface of the substrate,
- wherein in a third method step, the third layer is coated on the second layer using PVD and/or CVD, and in the third method step, arc deposition is used, forming droplets within the third layer,
- wherein the second layer is a hard layer composed of Ti, Zr, Nb, Cr, Al, Si, Ta or V independently or combined as alloys in metallic form or containing nitrogen, carbon, hydrogen and/or oxygen, and comprising Ag and/or Cu in metallic form,
- wherein the third layer is a top layer forming an outer surface of the coating and having a layer thickness between about 10 nm and about 400 nm and the top layer consists of TiN, and
- wherein the droplets are washed out of the top layer resulting in holes in the top layer, and the holes allow an ion-release to be facilitated.
Dependencies are inferred from the claim text.