# US 12,600,888 B2 · Dual-curable adhesive composition

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- Number: US 12,600,888 B2
- Document ID: US12600888B2
- Status: Granted
- Kind: B2
- Application number: 17/951,798
- Filed: 2022-09-23
- Published: 2023-01-26
- Granted: 2026-04-14
- Earliest claimed: 2020-03-23
- Assignees: Henkel AG & Co. KGaA
- Applicants: Henkel AG & Co. KGaA
- Inventors: Shingo Tsuno; Takayuki Kanno
- Web page: https://patentgrep.com/patent/US12600888B2

## CPC

- C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C08K 3/36: Silica
- C08K 7/18: inorganic
- H04N 23/50: Constructional details
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION

## Abstract

The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a dual-curable adhesive composition comprising: (a1) an oxetane compound, (a2) an alicyclic epoxy compound, (a3) an aromatic glycidyl ether-based epoxy compound, (b) a photocationic polymerization initiator, and (c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl)borate compound, wherein the amount of the component (a1) is 20 to 95 parts by mass, the amount of the component (a2) is 3 to 55 parts by mass, and the amount of the component (a3) is 3 to 45 parts by mass, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

## Claims

### Claim 1

A dual-curable adhesive composition comprising:
(a1) an oxetane compound,
(a2) an alicyclic epoxy compound,
(a3) an aromatic glycidyl ether-based epoxy compound,
(b) a photocationic polymerization initiator, and
(c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl) borate compound, wherein
the amount of the component (a1) is 30 to 60 parts by mass,
the amount of the component (a2) is 7 to 45 parts by mass, and
the amount of the component (a3) is 5 to 27 parts by mass,
each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

### Claim 2 (depends on 1)

The dual-curable adhesive composition according to claim 1, wherein the component (c) is an ammonium salt of tetrakis(pentafluorophenyl) boric acid.

### Claim 3 (depends on 1)

The dual-curable adhesive composition according to claim 1, further comprising (d) an inorganic filler.

### Claim 4 (depends on 1)

The dual-curable adhesive composition according to claim 1, which is used for assembling a camera module to bond a lens holder and a base plate on which an image capturing sensor is fixed.

### Claim 5 (depends on 1)

A cured product obtained by curing the dual-curable adhesive composition according to claim 1.

### Claim 6 (depends on 5)

A camera module comprising the cured product according to claim 5.

### Claim 7

A dual-curable adhesive composition comprising:
(a1) 50 parts by mass of an oxetane compound,
(a2) 25 parts by mass of an alicyclic epoxy compound,
(a3) 25 parts by mass of an aromatic glycidyl ether-based epoxy compound,
each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3),
(b) a photocationic polymerization initiator,
(c) a thermal cationic polymerization initiator comprising a tetrakis(pentafluorophenyl) borate compound, and
(d) an inorganic filler comprising silica.

### Claim 8 (depends on 7)

The dual curable adhesive composition according to claim 7, wherein
the amount of the component (b) is 2 parts by mass,
the amount of the component (c) is 1 part by mass, and
the amount of component (d) is 100 parts by mass,
each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).

### Claim 9 (depends on 8)

The dual curable adhesive composition according to claim 8, further comprising (e) 4 parts by mass of a thixo-imparting agent and 1 part by mass of a silane coupling agent, each based on 100 parts by mass of the total amount of the components (a1), (a2) and (a3).