# US 12,600,877 B2 · High-temperature Cu ink-based conductor with oxidation and corrosion resistance

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- Number: US 12,600,877 B2
- Document ID: US12600877B2
- Status: Granted
- Kind: B2
- Application number: 18/564,076
- Filed: 2022-05-25
- Published: 2024-08-15
- Granted: 2026-04-14
- Earliest claimed: 2021-05-25
- Assignees: The Research Foundation for The State University of New York
- Applicants: The Research Foundation for The State University of New York
- Inventors: Shenqiang Ren; Aaron Sheng; Saurabh Khuje
- Web page: https://patentgrep.com/patent/US12600877B2

## CPC

- C09D 11/52: Electrically conductive inks
- C09D 11/037: characterised by the pigment
- C09D 11/14: based on carbohydrates
- H01B 1/22: the conductive material comprising metals or alloys
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

Provided are conductive slurries with copper nanoplates. The copper nanoplates may be functionalized with formate groups and/or graphene or a graphene material. The slurries may be used as conductive inks, which may be used in 3D printing applications. Also provided are methods of making and using same.

## Claims

### Claim 1

A conductive slurry composition comprising a slurry of copper nanoplates in water, wherein the copper nanoplates comprise copper or a copper alloy and the conductive slurry composition comprises less than 10 wt. % copper nanowires, and wherein the copper nanoplates are surface functionalized with one or more formate groups.

### Claim 2 (depends on 1)

The conductive slurry composition according to claim 1, wherein the copper nanoplates have a longest linear dimension of 100 nm to 10 μm.

### Claim 3 (depends on 1)

The conductive slurry composition according to claim 1, wherein the copper nanoplates have a thickness of 10 to 100 nm.

### Claim 4 (depends on 1)

The conductive slurry composition according to claim 1, wherein the copper alloy is a copper gold alloy, a copper silver alloy, a copper zinc alloy, a copper aluminum alloy, a copper nickel alloy, or a copper platinum alloy.

### Claim 5 (depends on 1)

The conductive slurry composition according to claim 1, wherein the copper nanoplates further comprise iodide.

### Claim 6 (depends on 1)

The conductive slurry composition according to claim 1, further comprising (hydroxypropyl)methyl cellulose (HPMC) and the concentration of HPMC is 0.1 to 10 weight percent, relative to the total weight of the conductive ink.

### Claim 7 (depends on 1)

The conductive slurry composition according to claim 1, wherein the copper nanoplates are functionalized with graphene or a graphene material.

### Claim 8 (depends on 1)

The conductive slurry composition according to claim 1, wherein the conductive slurry composition is a conductive ink.

### Claim 9 (depends on 8)

A method of printing a conductive ink, comprising:
extruding a conductive ink composition according to claim 8; and
washing the extruded ink with an acid to remove residual aliphatic amine.

### Claim 10 (depends on 9)

The method according to claim 9, wherein the acid is an organic acid.

### Claim 11 (depends on 1)

A conductor printed using a conductive slurry composition according to claim 1.