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US 12,600,859 B2Granted
Polyamide compositions with high heat performance
AssigneeAscend Performance Materials Operations LLC
InventorsBradley J. Sparks, Jacob G. Ray
Life of this patent
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Abstract
A polyamide composition comprising from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide formed from 50 wt % to 90 wt % PA66; from 10-50 wt % of a second polyamide comprising a polyamide copolymer; from 0.01-10 wt % of a first stabilizer comprising a lanthanoid-based compound; from 0.01-10 wt % of a second stabilizer comprising a copper-based compound; and from 0-65 wt % filler.
Claims22
A polyamide composition comprising:
- from 25 wt % to 90 wt % of a first polyamide comprising a non-aromatic polyamide, the non-aromatic polyamide being a cycloaliphatic copolymer derived from 50 wt % to 90 wt % PA66 and from 10 wt % to 50 wt % cyclohexane diacid;
- from 10-50 wt % of a second polyamide comprising a polyamide copolymer;
- from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;
- from 0.01-10 wt % of a second stabilizer comprising a copper-based compound;
- and from 0-65 wt % filler,
- wherein, when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an impact resistance of 28 KJ/m2 or greater, as measured at 23° C.;
- or when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an increased impact resistance of 25% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.
4 more elements
A polyamide composition comprising:
- from 25 wt % to 90 wt % of a first polyamide comprising PA66/6C;
- from 10-50 wt % of a second polyamide comprising a polyamide copolymer;
- from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;
- from 0.01-10 wt % of a second stabilizer comprising a copper-based compound;
- and
- from 0-65 wt % filler,
- wherein, when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an impact resistance of 28 kJ/m2 or greater, as measured at 23° C.;
- or when heat aged for 3000 hours at a temperature of 210° C., the polyamide composition demonstrates an increased impact resistance of 25% or more, as measured at 23° C., when compared to a similar polyamide composition that does not contain a lanthanum-based compound.
5 more elements
A polyamide composition comprising:
- from 25 wt % to 90 wt % of a first polyamide, the first polyamide being a cycloaliphatic copolymer formed from PA66 and cyclohexane diacid;
- from 10-50 wt % of a second polyamide, the second polyamide being a polyamide copolymer;
- from 0.01-10 wt % of a first stabilizer comprising a lanthanum-based compound;
- from 0.01-10 wt % of a second stabilizer comprising a copper-based compound;
- and from 0-65 wt % filler.
2 more elements
Dependencies are inferred from the claim text.