Cover film
AssigneeFUJIFILM Corporation
InventorsMiyoko Hara, Takato Suzuki, Yasuyuki Sasada, Akio Tamura, Reiko Inushima
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AssigneeFUJIFILM Corporation
InventorsMiyoko Hara, Takato Suzuki, Yasuyuki Sasada, Akio Tamura, Reiko Inushima
Estimating the term…
An object of the present invention is to provide a cover film in which chips during cutting are unlikely to be generated, voids during bonding to a substrate using an enclosing solution are unlikely to be generated, and adhesiveness with the substrate is excellent. The cover film of the present invention is used for covering a test subject on a substrate, the cover film including a support and a polymer layer containing a polymer, in which a fracture toughness value of the polymer layer is 0.2 MPa·m0.5 or more, an in-plane retardation of the support at a wavelength of 590 nm is 1,000 nm or less, and a requirement regarding a dissolution rate of the polymer layer in xylene and a requirement regarding a viscosity of a xylene solution of the polymer layer are satisfied.
A cover film used for covering a test subject on a substrate, the cover film comprising:
Dependencies are inferred from the claim text.