# US 12,600,618 B2 · Semiconductor structure and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,600,618 B2 - Document ID: US12600618B2 - Status: Granted - Kind: B2 - Application number: 17/818,347 - Filed: 2022-08-08 - Published: 2024-02-08 - Granted: 2026-04-14 - Earliest claimed: 2022-08-08 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Taiwan Semiconductor Manufacturing Company Ltd. - Inventors: Jheng-Hong Jiang; Shing-Huang Wu; Chia-Wei Liu - Web page: https://patentgrep.com/patent/US12600618B2 ## CPC - B81B 3/0021: {Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00)} - B81B 3/007: {For controlling stiffness, e.g. ribs} - B81B 2201/0242: Gyroscopes - B81B 2203/0136: Comb structures - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract A semiconductor structure is provided. The semiconductor structure includes a substrate; a fixed structure, disposed on the substrate; a floating structure, connected to the fixed structure and separated from the substrate, wherein a first surface of the floating structure facing the substrate includes a plurality of recesses; and a capping layer, disposed on the first surface of the floating structure, wherein the capping layer exposes a portion of the floating structure. ## Claims ### Claim 1 A semiconductor structure, comprising: a substrate; a fixed structure, disposed on the substrate; a floating structure, connected to the fixed structure and separated from the substrate, wherein a first surface of the floating structure facing the substrate includes a plurality of recesses from a cross-sectional view; and a capping layer, disposed on the first surface of the floating structure, wherein the capping layer covers a bottom and sidewalls of at least one of the recesses and exposes a portion of the first surface of the floating structure outside the recesses. ### Claim 2 (depends on 1) The semiconductor structure of claim 1, wherein the floating structure includes a metallic material. ### Claim 3 (depends on 1) The semiconductor structure of claim 1, wherein the capping layer lines at least a portion of the plurality of recesses. ### Claim 4 (depends on 1) The semiconductor structure of claim 1, wherein the capping layer includes silicon nitride. ### Claim 5 (depends on 1) The semiconductor structure of claim 1, wherein the first surface includes a planar portion and a concave portion indented into the planar portion, and the capping layer exposes at least a portion of the planar portion of the first surface. ### Claim 6 (depends on 1) The semiconductor structure of claim 1, wherein the first surface includes a planar portion and a concave portion indented into the planar portion, and the capping layer exposes at least a portion of the concave portion of the first surface. ### Claim 7 A semiconductor structure, comprising: a substrate; a fixed structure, disposed on the substrate; a floating structure, connected to the fixed structure and separated from the substrate and including a first protruding portion and a second protruding portion extending away from the substrate; a first buffering structure covering sidewalls of the first protruding portion of the floating structure; and a second buffering structure covering sidewalls of the second protruding portion of the floating structure, wherein the first buffering structure and the second buffering structure comprise different materials, wherein a topmost surface of the first buffering structure is aligned with a topmost surface of the second buffering structure. ### Claim 8 (depends on 7) The semiconductor structure of claim 7, wherein a top surface of the first protruding portion of the floating structure is exposed through the first buffering structure, and a top surface of the second protruding portion of the floating structure is exposed through by the second buffering structure. ### Claim 9 (depends on 7) The semiconductor structure of claim 7, wherein a top surface of the first protruding portion of the floating structure is covered by the first buffering structure, and a top surface of the second protruding portion of the floating structure is covered by the second buffering structure. ### Claim 10 (depends on 8) The semiconductor structure of claim 8, wherein the first buffering structure is in contact with the second buffering structure. ### Claim 11 (depends on 7) The semiconductor structure of claim 7, wherein the first buffering structure includes polysilicon, silicon oxide (SiO2), phosphosilicate glass (PSG), fluorosilicate glass (FSG), silicon nitride (SiN), silicon oxynitride (SiON), silicon carbide (SiC), extra low-k materials (ELK), low-k materials (LK), hard black diamond (HBD), polysilicon, amorphous silicon, or a combination thereof. ### Claim 12 (depends on 7) The semiconductor structure of claim 7, wherein the floating structure and the second buffering structure include different conductive materials, and the floating structure or the second layer includes titanium (Ti), tantalum (Ta), aluminum (Al), copper (Cu), tungsten (W), an alloy thereof, or a combination thereof. ### Claim 13 (depends on 7) The semiconductor structure of claim 7, wherein the second buffering structure covers the fixed structure. ### Claim 14 A semiconductor structure, comprising: a substrate; a fixed structure, wherein the fixed structure comprises a bottom disposed on the substrate; a first conductive layer, connected to the fixed structure and separated from the substrate, wherein a top surface of the first conductive layer includes a planar portion and a first concave portion, and the first concave portion includes a first tilted surface tilted with respect to a bottom surface of the first conductive layer; a second conductive layer, connected to the fixed structure and over the first conductive layer; and a capping layer, disposed between the first conductive layer and the second conductive layer, and in contact with the top surface of the first conductive layer, wherein the first conductive layer, the second conductive layer and the capping layer are coupled to a sidewall of the fixed structure. ### Claim 15 (depends on 14) The semiconductor structure of claim 14, wherein the top surface of the first conductive layer further includes a second concave portion having a second tilted surface tilted with respect to the bottom surface of the first conductive layer, wherein a first angle between the first tilted surface and the bottom surface is different from a second angle between the second tilted surface and the bottom surface. ### Claim 16 (depends on 15) The semiconductor structure of claim 15, wherein the first concave portion and the second concave portion are symmetrically arranged. ### Claim 17 (depends on 14) The semiconductor structure of claim 14, wherein the second conductive layer comprises a plurality of protruding portions extending toward the first conductive layer at the first concave portion. ### Claim 18 (depends on 17) The semiconductor structure of claim 17, wherein each of the protruding portions has a surface substantially parallel to the first tilted surface. ### Claim 19 (depends on 14) The semiconductor structure of claim 14, wherein the capping layer includes silicon nitride. ### Claim 20 (depends on 14) The semiconductor structure of claim 14, wherein the second conductive layer is separated from the first conductive layer.