# US 12,600,135 B2 · Polymer based conductive paths for fluidic dies

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- Number: US 12,600,135 B2
- Document ID: US12600135B2
- Status: Granted
- Kind: B2
- Application number: 18/726,681
- Filed: 2022-01-21
- Published: 2025-03-20
- Granted: 2026-04-14
- Earliest claimed: 2022-01-21
- Assignees: Hewlett-Packard Development Company, L.P.
- Applicants: Hewlett-Packard Development Company, L.P.
- Inventors: Bo Song; Jacob Sterle; Tsuyoshi Yamashita
- Web page: https://patentgrep.com/patent/US12600135B2

## CPC

- B41J 2/1637: {molding}
- B41J 2/14072: {Electrical connections, e.g. details on electrodes, connecting the chip to the outside...}
- B41J 2/1601: {Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence)}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1626: {etching}
- B41J 2/1631: {photolithography}
- B41J 2/1635: {dividing the wafer into individual chips}
- B41J 2202/20: Modules
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

In example implementations, a fluidic die is provided. The fluidic die includes a silicon sliver with a plurality of nozzles to eject a printing fluid. A conductive path is deposited along a length of the silicon sliver on opposite sides of the silicon sliver. The conductive path and a portion of the silicon sliver are encapsulated by an epoxy molding compound.

## Claims

### Claim 1

A fluidic die, comprising:
a silicon sliver, wherein the silicon sliver comprises a plurality of nozzles to eject printing fluid;
a polymer based conductive path deposited along a length of the silicon sliver on opposite sides of the silicon sliver; and
an epoxy molding compound to encapsulate the polymer based conductive path and a portion of the silicon sliver.

### Claim 2 (depends on 1)

The fluidic die of claim 1, wherein the polymer based conductive path comprises a conductive adhesive.

### Claim 3 (depends on 2)

The fluidic die of claim 2, wherein the conductive adhesive comprises a conductive filler incorporated into a polymer resin having a resistivity of 10−4 ohm centimeters (2·cm) to 106 Ω·cm.

### Claim 4 (depends on 1)

The fluidic die of claim 1, wherein the polymer based conductive path comprises a conductive polymer.

### Claim 5 (depends on 4)

The fluidic die of claim 4, wherein the conductive polymer comprises a polymer that is doped to have a resistivity between 10−2 ohm centimeters (Ω·cm) to 108 Ω·cm.

### Claim 6 (depends on 5)

The fluidic die of claim 5, wherein the polymer comprises at least one of: poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PDOT/PSS), polythiophene, polyaniline, polypyrrole, or polyacetylene.

### Claim 7

A fluid ejection device, comprising:
a reservoir body to store a printing fluid; and
a printhead coupled to the reservoir body, wherein the printhead comprises:
an electrical pad; and
a fluidic die electrically connected to the electrical pad, wherein the fluidic die comprises polymer based conductive paths in contact with silicon slivers, wherein the conductive paths and the silicon slivers are encapsulated within an epoxy molding compound.

### Claim 8 (depends on 7)

The fluid ejection device of claim 7, wherein the polymer based conductive paths are located on opposite sides of each silicon sliver of the silicon slivers.

### Claim 9 (depends on 7)

The fluid ejection device of claim 7, wherein the polymer based conductive paths are located along a length of each silicon sliver of the silicon slivers to dissipate electrostatic discharges (ESDs) away from electrically sensitive components on the silicon slivers.

### Claim 10 (depends on 9)

The fluid ejection device of claim 9, wherein the electrically sensitive components comprise nozzles on the silicon slivers.

### Claim 11 (depends on 7)

The fluid ejection device of claim 7, wherein the polymer based conductive paths comprise a polymer based conductive adhesive or a conductive polymer.