Thermoforming device

A thermoforming device comprising:

• a controller;
• a vacuum pump;
• a valve;
• a radiation heater;
• and
• a base configured to oppose the radiation heater with a resin film interposed therebetween, wherein
• the controller is configured to control heating of the resin film to a predetermined temperature with the radiation heater, and bonding of the resin film, which has been heated by the radiation heater, to a fiber molding placed on the base,
• the controller is configured to control the vacuum pump and the valve to
• evacuate a space between the fiber molding and the resin film to bring the resin film into close contact with the fiber molding in the bonding,
• evacuate the space at a first exhaust rate during the heating of the resin film with the radiation heater to prevent air enclosed between the fiber molding and the resin film from expanding and thereby prevent the resin film from expanding, and
• evacuate the space at a second exhaust rate during the bonding of the resin film, and
• the radiation heater is changeable in distance to the resin film between a first heating position for radiationally heating the resin film in the heating and a second heating position for radiationally heating the resin film in the bonding.