# US 12,600,062 B2 · Method and device for detaching a stamp

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- Number: US 12,600,062 B2
- Document ID: US12600062B2
- Status: Granted
- Kind: B2
- Application number: 17/762,411
- Filed: 2019-12-02
- Published: 2022-10-27
- Granted: 2026-04-14
- Earliest claimed: 2019-12-02
- Assignees: EV Group E. Thallner GmbH
- Applicants: EV Group E. Thallner GmbH
- Inventors: Robert Breyer
- Web page: https://patentgrep.com/patent/US12600062B2

## CPC

- B29C 33/3842: {Manufacturing moulds, e.g. shaping the mould surface by machining}
- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- B29C 59/02: by mechanical means, e.g. pressing {(B29C59/007 takes precedence; embossing expanded porous articles B29C44/5627)}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

The invention relates to a method for detaching a stamp from a substrate, in particular from a master stamp and/or from a product. The stamp is deformed in a direction of the substrate in order to detach the stamp from the susbtrate.

## Claims

### Claim 1

A device for detaching a stamp from a substrate, comprising:
a carrier in contact with the stamp; and
a carrier form element configured to deform and tension the carrier in contact with the stamp to deform the stamp in a direction of the substrate in order to detach the stamp in contact with the carrier from the substrate, the carrier form element comprising:
at least one carrier form element elevation over which the carrier is stretched and in contact therewith, the carrier form element elevation being configured to lift a carrier stamp side of the carrier off of a remaining part of the carrier form element when the carrier is tensioned; and
at least one fixing element configured to fix the carrier and deliver a gas and/or a gas mixture to an intermediate space between the carrier form element and the carrier.