# US 12,600,008 B2 · Substrate polishing apparatus and method of polishing substrate using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,600,008 B2 - Document ID: US12600008B2 - Status: Granted - Kind: B2 - Application number: 18/210,107 - Filed: 2023-06-15 - Published: 2023-12-28 - Granted: 2026-04-14 - Earliest claimed: 2022-06-27 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Samsung Electronics Co., Ltd. - Inventors: Donghoon Kwon; Boun Yoon - Web page: https://patentgrep.com/patent/US12600008B2 ## CPC - B24B 53/017: Devices or means for dressing, cleaning or otherwise conditioning lapping tools - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A substrate polishing apparatus includes a polishing pad including a magnetic material, a platen having an upper surface to which the polishing pad is attached, a slurry supply unit installed on the polishing pad, a conditioner installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction and configured to fine-polish a surface of the polishing pad, a polishing head installed on the polishing pad to be spaced apart from the conditioner in the one direction and configured to rotate a polishing target, and a magnetic module installed on the polishing pad to be disposed between the conditioner and the polishing head in the one direction and configured to apply magnetic force to polishing pad debris to remove the polishing pad debris. ## Claims ### Claim 1 A substrate polishing apparatus comprising: a polishing pad including a magnetic material; a platen having an upper surface to which the polishing pad is attached and installed to be rotatable in one direction; a slurry supply unit installed on the polishing pad and configured to supply slurry to the polishing pad; a conditioner installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction and configured to fine-polish a surface of the polishing pad; a polishing head installed on the polishing pad to be spaced apart from the conditioner in the one direction and configured to adhere a semiconductor substrate to the polishing pad and to rotate the adhered semiconductor substrate; and a magnetic module installed on the polishing pad to be disposed between the conditioner and the polishing head in the one direction and configured to apply magnetic force to polishing pad debris to remove the polishing pad debris, the polishing pad debris generated on the surface of the polishing pad while the surface of the polishing pad is polished. ### Claim 2 (depends on 1) The substrate polishing apparatus of claim 1, further comprising: a cleaning unit disposed in an outer portion of the platen and configured to inject cleaning liquid to the magnetic module to clean the magnetic module. ### Claim 3 (depends on 1) The substrate polishing apparatus of claim 1, wherein the magnetic module comprises: a body portion; and a magnetic portion disposed on a lower surface of the body portion and configured to generate the magnetic force. ### Claim 4 (depends on 3) The substrate polishing apparatus of claim 3, wherein the magnetic portion includes at least one of a permanent magnet and an electromagnet. ### Claim 5 (depends on 3) The substrate polishing apparatus of claim 3, wherein the body portion has a bar shape. ### Claim 6 (depends on 5) The substrate polishing apparatus of claim 5, wherein the magnetic portion includes a plurality of magnetic materials, and wherein the plurality of magnetic materials are disposed to be spaced apart from each other in a length direction of the body portion. ### Claim 7 (depends on 1) The substrate polishing apparatus of claim 1, wherein the magnetic module comprises: a cylindrical body portion having a rotation shaft, parallel to the surface of the polishing pad; and a magnetic portion disposed on a side surface of the cylindrical body portion and configured to generate the magnetic force. ### Claim 8 (depends on 1) The substrate polishing apparatus of claim 1, wherein the magnetic module comprises: a disk-shaped body portion having a rotation shaft, perpendicular to the surface of the polishing pad; and a magnetic portion disposed on a lower surface of the disk-shaped body portion and configured to generate the magnetic force. ### Claim 9 (depends on 1) The substrate polishing apparatus of claim 1, wherein the magnetic material includes at least one of a magnetic polymer and a magnetic particle. ### Claim 10 (depends on 9) The substrate polishing apparatus of claim 9, wherein the magnetic polymer includes a polymer PANICNQ, a combination of emeraldine-based polyaniline (PANi) and tetracyanoquinodimethane (TCNQ). ### Claim 11 (depends on 9) The substrate polishing apparatus of claim 9, wherein the magnetic particle includes at least one of FE3O4 and CoFe2O4. ### Claim 12 (depends on 1) The substrate polishing apparatus of claim 1, wherein the polishing pad comprises: a first region disposed in a center of the polishing pad and having a first magnetic property; and a second region disposed in the form of a ring having a predetermined width to surround the first region and having a second magnetic property, greater than the first magnetic property. ### Claim 13 A substrate polishing apparatus comprising: a platen having an upper surface, to which a polishing pad including a magnetic material is attached, and installed to be rotatable in one direction; a conditioner installed on the polishing pad and configured to modify surface roughness of the polishing pad; a magnetic module installed on the polishing pad to be spaced apart from the conditioner in the one direction and including an electromagnet applying magnetic force to polishing pad debris, the polishing pad debris generated on the a surface of the polishing pad while the surface of the polishing pad is fine-polished; a power supply device configured to supply power for generating the magnetic force to the electromagnet of the magnetic module on the polishing pad; and a control unit configured to control the power supply device to control an operation of the magnetic module. ### Claim 14 (depends on 13) The substrate polishing apparatus of claim 13, further comprising: a cleaning unit disposed in an outer portion of the platen and configured to inject cleaning liquid to the magnetic module to clean the magnetic module. ### Claim 15 (depends on 14) The substrate polishing apparatus of claim 14, wherein the control unit cuts off the power while the cleaning unit injects the cleaning liquid to the magnetic module. ### Claim 16 (depends on 13) The substrate polishing apparatus of claim 13, wherein the polishing pad debris is attached to the magnetic module by the magnetic force when the power is supplied to the magnetic module. ### Claim 17 A substrate polishing apparatus comprising: a polishing pad including a magnetic material; a platen having a surface, to which a-the polishing pad including & the magnetic material is attached, and installed to be rotatable in one direction; a conditioner installed on the polishing pad and configured to condition a surface of the polishing pad; and a magnetic module installed on the polishing pad to be spaced apart from the conditioner in the one direction and configured to apply attractive force generated by a magnetic field to polishing pad debris to remove the polishing pad debris from the surface of the polishing pad, the polishing pad debris generated on the surface of the polishing pad while the conditioner conditions the surface of the polishing pad . . . ### Claim 18 (depends on 17) The substrate polishing apparatus of claim 17, wherein the magnetic module includes an electromagnet. ### Claim 19 (depends on 18) The substrate polishing apparatus of claim 18, comprising: a power supply device configured to supply power for generating the magnetic field to the electromagnet of the magnetic module; and a control unit configured to control the power supply device to control an operation of the magnetic module. ### Claim 20 (depends on 17) The substrate polishing apparatus of claim 17, wherein the magnetic module incudes a permanent magnet, and wherein the permanent magnet is a neodymium magnet.