# US 12,600,006 B2 · Polishing pad with window and method of manufacturing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,600,006 B2 - Document ID: US12600006B2 - Status: Granted - Kind: B2 - Application number: 18/048,191 - Filed: 2022-10-20 - Published: 2023-05-25 - Granted: 2026-04-14 - Earliest claimed: 2021-11-19 - Assignees: SK hynix Inc.; Enpulse Co., Ltd. - Applicants: SK hynix Inc.; SK enpulse Co., Ltd. - Inventors: Yu Jin Heo; Hyun Goo Kang; Go Un Kim; Jang Won Seo; Sung Hoon Yun - Web page: https://patentgrep.com/patent/US12600006B2 ## CPC - B24B 37/205: {provided with a window for inspecting the surface of the work being lapped} - B24B 37/22: characterised by a multi-layered structure - B24B 37/24: characterised by the composition or properties of the pad materials - B24B 37/26: characterised by the shape of the lapping pad surface, e.g. grooved - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract This invention relates to a polishing pad and a method for manufacturing the same. The polishing pad may include a top pad layer and a window block. The top pad layer may include a groove pattern formed on an upper surface of the top pad layer. A first hole may be formed through the top pad layer. The window block may be inserted into the first hole. The top pad layer and the window block may have a structure coincided with following Formula 1. 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 3. Formula ⁢ 1 In Formula 1, the gap may indicate a height difference between an upper surface of the top pad layer and an upper surface of the window block, the ThkRTPC may indicate a thickness of the window block, and the Thkgrv may indicate a depth of the groove pattern. ## Claims ### Claim 1 A polishing pad comprising: a top pad layer including a groove pattern formed at an upper surface of the top pad layer to a first depth and a first hole formed through the top pad layer; a window block inserted into the first hole, and disposed to form a first hole gap formed between the upper surface of the top pad layer and an upper surface of the window block; wherein the top pad layer and the window block satisfy Formula 1: 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 3. , wherein Gap in Formula 1 indicates a height difference between the upper surface of the top pad layer and an upper surface of the window block at the first hole gap, and the Gap in Formula 1 ranges from 0.001 mm to 2 mm, ThkRTPC indicates a thickness of the window block and Thkgrv indicates a depth of the groove pattern. ### Claim 2 (depends on 1) The polishing pad of claim 1, wherein the depth of the groove pattern is 0.5 mm to 2 mm. ### Claim 3 (depends on 1) The polishing pad of claim 1, wherein a thickness of the top pad layer is 0.5 mm to 5 mm. ### Claim 4 (depends on 1) The polishing pad of claim 1, wherein a thickness of an upper portion of the window block is 0.2 mm to 5 mm. ### Claim 5 (depends on 1) The polishing pad of claim 1, wherein the window block further includes a recess formed at a central portion of a lower surface of the window block. ### Claim 6 (depends on 1) The polishing pad of claim 1, wherein the height difference between the upper surface of the top pad layer and the upper surface of the window block is 0.01 mm to 2 mm. ### Claim 7 (depends on 1) The polishing pad of claim 1, further comprising a sub-pad layer arranged on a lower surface of the top pad layer, the sub-pad layer including a second hole that is formed through a portion of the sub-pad layer corresponding to the first hole. ### Claim 8 (depends on 7) The polishing pad of claim 7, wherein the second hole has a cross-sectional area smaller than a cross-sectional area of the first hole. ### Claim 9 (depends on 7) The polishing pad of claim 7, further comprising a first adhesive layer arranged between the top pad layer and the sub-pad layer, the first adhesive layer including a third hole connected to the first hole and the second hole. ### Claim 10 (depends on 9) The polishing pad of claim 9, wherein the first adhesive layer has a thickness of 0.001 mm to 3 mm. ### Claim 11 (depends on 1) The polishing pad of claim 1, further comprising an additional adhesive layer arranged on a lower surface of the window block. ### Claim 12 (depends on 7) The polishing pad of claim 7, wherein the sub-pad layer comprises a thermally fused portion formed at a portion of the sub-pad layer adjacent to a lower surface of the window block. ### Claim 13 (depends on 1) The polishing pad of claim 1, wherein the top pad layer and the window block satisfy Formula 2: 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 1.9 . ### Claim 14 (depends on 1) The polishing pad of claim 1, wherein the window block further includes a gap-controlling film formed on the upper surface of the window block. ### Claim 15 A method of manufacturing a polishing pad, the method comprising: providing a top pad layer with a groove pattern on an upper surface of the top pad layer; forming a first hole in the top pad layer; and forming a window block in the first hole such that a first hole gap is formed between the upper surface of the top pad layer and an upper surface of the window block, wherein the top pad layer and the window block are formed to satisfy Formula 1, 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 3. , wherein Gap in Formula 1 indicates a height difference between the upper surface of the top pad layer and an upper surface of the window block at the first hole gap, and the Gap in Formula 1 ranges from 0.001 mm to 2 mm, ThkRTPC indicates a thickness of the window block and Thkgrv indicates a depth of the groove pattern. ### Claim 16 (depends on 15) The method of claim 15, further comprising: forming a gap-controlling film for adjusting the height difference on one surface of the window block; and pressing an upper surface of the gap-controlling film. ### Claim 17 (depends on 15) The method of claim 15, further comprising: forming a sub-pad layer with a second hole smaller than the first hole, on a lower surface of the top pad layer; forming a first adhesive layer with a third hole between the lower surface of the top pad layer and the sub pad layer; and forming an additional adhesive layer on an upper surface of the first adhesive layer around the third hole. ### Claim 18 (depends on 17) The method of claim 17, further comprising forming a fused portion on a lower surface of the first adhesive layer exposed by the second hole. ### Claim 19 (depends on 15) The method of claim 15, wherein the top pad layer and the window block are formed to satisfy Formula 2, 1.1 ≤ Gap + Thk RTPC Thk grv ≤ 1.9 .