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US 12,599,990 B2Granted
Liquid cold welding methods and apparatus
AssigneeAddionics IL Ltd
InventorsVladimir Yufit, Le Sheng Nicholas Yiu, Belen Bello Rodriguez, Farid Tariq, Moshiel Biton, Nir Halup
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Abstract
The application discloses a method of liquid cold welding (LCW) including: (a) engaging two or more porous conductive substrate layers between perforated non-conductive frames so that the substrate layers contact one another; (b) immersing the substrate layers in an electrolyte solution; and (c) applying electric current and/or voltage and/or electric power to the electrolyte solution. Apparatus suitable for performance of some embodiments of the method are also disclosed.
Claims7
A method of electrochemical deposition comprising:
- (a) folding a single porous conductive substrate layer to form two or more porous conductive substrate layers;
- (b) engaging said substrate layers between perforated non-conductive frames so that said substrate layers contact one another;
- (c) immersing said substrate layers in an electrolyte solution that contains dissolved metal ions;
- and
- (d) applying electric current and/or voltage and/or electric power to said electrolyte solution to effect metal or metal composite deposition from said ions in said electrolyte solution onto said substrate layers, thereby joining said two or more porous conductive substrate layers.
2 more elements
Dependencies are inferred from the claim text.