# US 12,599,989 B2 · Laser processing method that includes use of a sheet that has transmissibility

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- Number: US 12,599,989 B2
- Document ID: US12599989B2
- Status: Granted
- Kind: B2
- Application number: 17/805,545
- Filed: 2022-06-06
- Published: 2022-12-22
- Granted: 2026-04-14
- Earliest claimed: 2021-06-21
- Assignees: Disco Corporation
- Applicants: Disco Corporation
- Inventors: Masaru Nakamura
- Web page: https://patentgrep.com/patent/US12599989B2

## CPC

- B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
- B23K 26/702: {Auxiliary equipment}
- B23K 37/0408: {for planar work}
- B23K 2101/40: Semiconductor devices
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A processing method includes a holding step of holding a workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface and a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility. The processing method also includes a close contact step of generating a suction force for the holding surface of the chuck table and reducing the pressure on a region covered by the sheet to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet and a modified layer forming step of positioning the focal point of a laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form a modified layer.

## Claims

### Claim 1

A processing method in which a focal point of a laser beam with such a wavelength as to be transmitted through a workpiece is positioned inside the workpiece and the workpiece is irradiated with the laser beam to form a modified layer inside the workpiece, the processing method comprising:
a holding step of holding the workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface;
a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility, wherein the sheet is deformable;
a close contact step of generating a suction force for the holding surface of the chuck table and reducing a pressure on a region covered by the sheet, to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet; and
a modified layer forming step of positioning the focal point of the laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form the modified layer, and
wherein during the close contact step, the sheet is deformed along the upper surface of the workpiece, an outer peripheral surface of the workpiece, and a portion of the upper surface of the chuck table.

### Claim 2 (depends on 1)

The processing method according to claim 1, wherein the workpiece is a wafer on which a plurality of devices are formed on a front surface in such a manner as to be marked out by a plurality of planned dividing lines that intersect each other, and the modified layers are formed inside the wafer along the planned dividing lines in the modified layer forming step.

### Claim 3 (depends on 1)

The processing method according to claim 1, wherein the workpiece is an ingot, and the modified layers are formed in a whole region of an inside of the ingot corresponding to a thickness of a wafer to be generated from the ingot, in the modified layer forming step.

### Claim 4 (depends on 1)

The processing method according to claim 1, wherein the sheet is formed of a polyolefin.

### Claim 5 (depends on 1)

The processing method according to claim 1, wherein the sheet is formed of polyethylene terephthalate.

### Claim 6 (depends on 1)

The processing method according to claim 1, wherein the sheet is formed of polyvinyl chloride.