# US 12,599,964 B2 · Bonding composition, conductor bonding structure, and method for producing same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,599,964 B2 - Document ID: US12599964B2 - Status: Granted - Kind: B2 - Application number: 18/438,801 - Filed: 2024-02-12 - Published: 2024-06-06 - Granted: 2026-04-14 - Earliest claimed: 2018-08-08 - Assignees: Mitsui Kinzoku Company, Limited - Applicants: Mitsui Mining & Smelting Co., Ltd. - Inventors: Kei Anai; Shinichi Yamauchi - Web page: https://patentgrep.com/patent/US12599964B2 ## CPC - B22F 7/064: {using an intermediate powder layer} - B22F 1/10: Metallic powder containing lubricating or binding agents; Metallic powder containing organic material - B22F 1/107: containing organic material comprising solvents, e.g. for slip casting - B22F 1/145: Chemical treatment, e.g. passivation or decarburisation - B22F 7/04: with one or more layers not made from powder, e.g. made from solid metal - H01B 1/20: Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} - H01B 1/22: the conductive material comprising metals or alloys - B22F 1/103: containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent - H10W 72/01323: {in liquid form, e.g. by dispensing droplets or by screen printing} - H10W 72/01365: {Thermally treating (reflowing H10W72/01357)} - H10W 72/0198: {batch processes} - H10W 72/07331: {Connecting techniques} - H10W 72/07332: {Compression bonding, e.g. thermocompression bonding} - H10W 72/07341: {Controlling the bonding environment, e.g. atmosphere composition or temperature} - H10W 72/30: Die-attach connectors - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics} - H10W 72/354: {comprising polymers} - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydrox ymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s−1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder. ## Claims ### Claim 1 A method for producing a conductor bonding structure, the method comprising: applying onto a surface of a first conductor a bonding composition comprising copper powder, a liquid medium and a reducing agent to form a coating film; drying the coating film to obtain a dried coating film; applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and sintering, under pressure, the copper powder contained in the dried coating film to bond the first conductor and the second conductor, wherein the reducing agent has a boiling point that is higher than the boiling point of the liquid medium, the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder, the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C., a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and the reducing agent contains at least one amino group and a plurality of hydroxyl groups. ### Claim 2 (depends on 1) The method according to claim 1, wherein the coating film is dried in such a manner that the content of the liquid medium is reduced to 9 mass % or less with respect to the total mass of the coating film. ### Claim 3 (depends on 1) The method according to claim 1, wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s−1 at 25° C. ### Claim 4 (depends on 1) The method according to claim 1, wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder. ### Claim 5 A method for bonding conductors, the method comprising: applying onto a surface of a first conductor a bonding composition comprising copper powder, a liquid medium and a reducing agent to form a coating film; drying the coating film to obtain a dried coating film; applying a second conductor onto the dried coating film to interpose the dried coating film between the first conductor and the second conductor; and sintering, under pressure, the copper powder contained in the dried coating film to bond the first conductor and the second conductor, wherein the reducing agent has a boiling point that is higher than the boiling point of the liquid medium, the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder, the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C., a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and the reducing agent contains at least one amino group and a plurality of hydroxyl groups. ### Claim 6 (depends on 5) The method according to claim 5, wherein the coating film is dried in such a manner that the content of the liquid medium is reduced to 9 mass % or less with respect to the total mass of the coating film. ### Claim 7 (depends on 5) The method according to claim 5, wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pas at a shear rate of 10 s−1 at 25° C. ### Claim 8 (depends on 5) The method according to claim 5, wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder. ### Claim 9 A bonding composition used for bonding a first conductor and a second conductor under pressure, wherein: the bonding composition comprises copper powder, a liquid medium and a reducing agent, the reducing agent has a boiling point that is higher than the boiling point of the liquid medium, the reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder, the liquid medium comprises an alcohol having a boiling point of 188° C. or higher and lower than 300° C., a proportion of the liquid medium is from 10 parts to 40 parts by mass with respect to 100 parts by mass of the copper powder, and the reducing agent contains at least one amino group and a plurality of hydroxyl groups. ### Claim 10 (depends on 9) The bonding composition according to claim 9, wherein the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s−1 at 25° C. ### Claim 11 (depends on 9) The bonding composition according to claim 9, wherein the bonding composition contains the reducing agent at an amount of from 0.1 parts to 10 parts by mass with respect to 100 parts by mass of the copper powder. ### Claim 12 A conductor bonding structure, in which two conductors are electrically connected by a joint portion, wherein: the joint portion comprises a sintered structure of copper materials; and a moiety shown below is formed in the joint portion: wherein: * represents a bonding hand with copper. ### Claim 13 (depends on 9) The bonding composition according to claim 9, wherein the alcohol comprises a polyol.