Optoelectronic microdevice
AssigneeVueReal Inc.
InventorsGholamreza Chaji, Hossein Zamani Siboni, Ehsanollah Fathi
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Abstract
The present disclosure relates to development of microdevices on a substrate that can be released and transferred to a system substrate. The disclosure further relates to methods to integrate anchors to hold a microdevice to a substrate. The microdevices are in different configurations with respect to anchors, release layers, buffers layers and substrate.
Claims18
A method to integrate anchors for holding microdevices to a substrate, the method comprising:
- forming at least one microdevice on a first substrate wherein a release layer is deposited only on the at least one microdevice and patterned, and the release layer is extended at least from a part of a microdevice edge of the at least one microdevice;
- having pads on the microdevice on a top side away from the first substrate;
- covering microdevices by passivation layers;
- and
- covering the microdevice with a protection layer.
A method to integrate anchors for holding a microdevice to a substrate, the method comprising:
- forming at least two anchors around each microdevice wherein a release layer is formed under each microdevice, and the release layer is extended at least from a part of a microdevice edge;
- and
- having the anchors for the adjacent microdevices offsetted.
A method to integrate anchors to hold a microdevice to a substrate, the method comprising;
- forming an anchor on a top of a substrate;
- separating at least a part of the anchor from the substrate with a release layer deposited only on the microdevice and wherein the release layer is extended at least from a part of a microdevice edge;
- and
- coupling the microdevice to the anchor with a bonding agent.
Dependencies are inferred from the claim text.