# US 12,599,043 B2 · Semiconductor device package and method of manufacturing the same

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- Number: US 12,599,043 B2
- Document ID: US12599043B2
- Status: Granted
- Kind: B2
- Application number: 18/119,784
- Filed: 2023-03-09
- Published: 2024-09-12
- Granted: 2026-04-07
- Earliest claimed: 2023-03-09
- Assignees: Advanced Semiconductor Engineering, Inc.
- Applicants: Advanced Semiconductor Engineering, Inc.
- Inventors: Wei-Hao Chang
- Web page: https://patentgrep.com/patent/US12599043B2

## CPC

- H10W 90/00: Package configurations
- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/635: {Through-vias}
- H10W 70/685: comprising multiple insulating layers
- H10W 74/121: {by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation}
- H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 74/014: {using batch processing}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/473: {containing a filler}
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first circuit layer, a second circuit layer under the first circuit layer, a first electronic component between the first circuit layer and the second circuit layer and connected to the first circuit layer and a sub-package between the first circuit layer and the second circuit layer and connected to the second circuit layer. The sub package comprises a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component.

## Claims

### Claim 1

An electronic device, comprising:
a first circuit structure;
a first electronic component disposed under the first circuit structure;
a package structure disposed under the first circuit structure and comprising a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component, wherein the package structure comprises a first encapsulant covering the second electronic component; and
a second encapsulant covering the first electronic component and the package structure.

### Claim 2 (depends on 1)

The electronic device of claim 1, further comprising:
a third component disposed under the first circuit structure and separated from the second electronic component by the conductive structure.

### Claim 3 (depends on 2)

The electronic device of claim 2, wherein the conductive structure is configured to provide electromagnetic shielding function between the second electronic component and the third electronic component.

### Claim 4 (depends on 1)

The electronic device of claim 1, further comprising:
a second circuit structure disposed under the package structure; and
an interposer supporting the first circuit structure, wherein the interposer is configured to provide a signal transmission path between the first circuit structure and the second circuit structure.

### Claim 5 (depends on 4)

The electronic device of claim 4, wherein the package structure supports the first electronic component and is configured to provide a non-signal transmission path between the first electronic component and the second circuit structure.

### Claim 6 (depends on 1)

The electronic device of claim 1, wherein the conductive structure is configured to provide electromagnetic shielding function between the first electronic component and the second electronic component.

### Claim 7 (depends on 1)

The electronic device of claim 1, wherein a portion of the second encapsulant is disposed under the package structure.

### Claim 8 (depends on 4)

The electronic device of claim 4, wherein the conductive structure and the second circuit structure are configured to provide a first heat dissipation path for dissipating the heat from the first electronic component, and wherein the conductive structure, the second electronic component and the second circuit structure are configured to provide a second heat dissipation path for dissipating the heat from the first electronic component, and wherein a heat dissipation efficiency of the first heat dissipation path is higher than a heat dissipation efficiency of the second heat dissipation path.

### Claim 9 (depends on 4)

The electronic device of claim 4, wherein the conductive structure is connected to the second circuit structure through a first conductive element to form a non-signal transmission path, and wherein the second electronic component is connected to the second circuit structure through a second conductive element to form a signal transmission path.