LED chip module and method for manufacturing LED chip module

A flip LED chip module, comprising:

• a substrate;
• and
• a flip LED chip, wherein a conductive connection material is provided on portions of an upper surface of the substrate corresponding to pads of the flip LED chip;
• wherein a positive electrode and a negative electrode of the flip LED chip are disposed on the portions of the substrate covered by the conductive connection material and are electrically connected to the pads of flip LED chip;
• wherein a bottom portion of a chip body of the flip LED chip is provided with two pad slots recessed upwardly, the pad corresponding to the positive electrode is disposed on a bottom of one of the two pad slots, and the pad corresponding to the negative electrode is disposed on a bottom of the other one of the two pad slots;
• a gap is between a side surface of each of the pads and a side wall of a corresponding pad slot of the two pad slots;
• wherein the gap between the side surface of each of the pads and the side wall of the corresponding pad slot gradually increases from the bottom of the corresponding pad slot to the opening of the corresponding pad slot distant from the bottom of the corresponding pad slot.