Package structure and method of forming the same

A method of forming a package structure, comprising:

• forming at least one device die, comprising:
• providing a substrate having a die region and a scribe line region;
• forming an interconnect structure on the substrate in the die region;
• forming a debris layer on the substrate in the scribe line region and overlying a sidewall of the interconnect structure;
• and
• forming a protective layer extending from a top surface of the interconnect structure to cover a surface of the debris layer;
• and
• forming an encapsulant to laterally encapsulate the at least one device die, wherein the encapsulant is physically spaced from the debris layer by the protective layer, and a Young's modulus of the protective layer is less than a Young's modulus of the encapsulant.

A method of forming a package structure, comprising:

• forming a first opening in a semiconductor wafer between a first semiconductor die and a second semiconductor die, and a debris layer is formed on a sidewall of the first opening simultaneously;
• forming a stress buffer layer to fill in the first opening and cover the debris layer;
• forming a second opening in the stress buffer layer within the first opening;
• cutting the semiconductor wafer to form a third opening, wherein the second opening is in spatial communication with the third opening to separate the first semiconductor die from the second semiconductor die;
• and
• forming an encapsulant to laterally encapsulate the first semiconductor die and/or the second semiconductor die, wherein the encapsulant is physically spaced from the debris layer by the stress buffer layer.