Semiconductor packages having adhesive members
AssigneeSamsung Electronics Co., Ltd.
InventorJooyoung Oh
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a package substrate, a first semiconductor chip and a second semiconductor chip sequentially stacked on the package substrate, the first semiconductor chip and the second semiconductor chip being disposed in a form of an offset stack structure, and the second semiconductor chip including an overhang further protruding beyond a side surface of the first semiconductor chip in a first horizontal direction, an adhesive member disposed on a lower surface of the second semiconductor chip, the adhesive member including an extension extending to a lower level than an upper surface of the first semiconductor chip. The extension contacts the side surface of the first semiconductor chip, and overlaps with at least a portion of the overhang in a vertical direction.
Claims20
A semiconductor package comprising:
- a package substrate including upper pads;
- a first semiconductor chip and a second semiconductor chip sequentially stacked on the package substrate, the first semiconductor chip and the second semiconductor chip being disposed in a form of an offset stack structure, and the second semiconductor chip including an overhang further protruding beyond a side surface of the first semiconductor chip in a first horizontal direction;
- bonding wires connecting the first semiconductor chip and the second semiconductor chip to the upper pads;
- an adhesive member disposed on a lower surface of the second semiconductor chip and fixing the second semiconductor chip to the first semiconductor chip, the adhesive member including an extension extending to a lower level than an upper surface of the first semiconductor chip;
- and
- an encapsulant covering the package substrate, the first semiconductor chip, and the second semiconductor chip,
- wherein the extension contacts the side surface of the first semiconductor chip, and overlaps with at least a portion of the overhang in a vertical direction.
A semiconductor package comprising:
- a package substrate including upper pads;
- first to fourth semiconductor chips sequentially stacked on the package substrate, the first to fourth semiconductor chips being disposed in a form of an offset stack structure, and each of the second to fourth semiconductor chips including an overhang further protruding in a first horizontal direction beyond a side surface of a semiconductor chip disposed immediately thereunder;
- bonding wires connecting the first to fourth semiconductor chips to the upper pads;
- adhesive members respectively disposed on lower surfaces of the second to fourth semiconductor chips and respectively fixing the second to fourth semiconductor chips to the first to third semiconductor chips, the adhesive members including extensions, respectively;
- and
- an encapsulant covering the package substrate and the first to fourth semiconductor chips,
- wherein a lowermost one of the extensions contacts the side surface of the first semiconductor chip, and overlaps with at least a portion of the overhang of the second semiconductor chip in a vertical direction.
Dependencies are inferred from the claim text.