Semiconductor packages with patterns of die-specific information
AssigneeMicron Technology, Inc.
InventorFederico Pio
Life of this patent
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Abstract
Semiconductor device packages and associated methods are disclosed herein. In some embodiments, the semiconductor device package includes (1) a first surface and a second surface opposite the first surface; (2) a semiconductor die positioned between the first and second surfaces; and (3) a pattern positioned in a designated area of the first surface. The pattern includes multiple bit areas. Each of the bit areas represents a first bit information or a second bit information. the pattern presents information for operating the semiconductor die. The pattern is configured to be read by a pattern scanner.
Claims20
A method of forming a semiconductor device package, the method comprising:
- positioning a semiconductor die between a first surface of the package and a second surface of the package that is opposite the first surface;
- forming a pattern in a designated area of the first surface, the pattern including multiple bit areas, each of the bit areas representing a first bit information or a second bit information, the pattern presenting information for operating the semiconductor die, the pattern being configured to be read by a pattern scanner, wherein each of the bit area includes at least one dot or at least one vacant region.
A method of forming a semiconductor device, the method comprising:
- forming a machine-readable pattern on an external surface of the semiconductor device, the pattern representing information for operating the semiconductor device,
- wherein the pattern includes a plurality of bit areas, and wherein each of plurality of bit areas includes at least one dot or at least one vacant region.
A method of reading information from a semiconductor device, the method comprising:
- scanning, with a pattern scanner, a machine-readable pattern on an external surface of the semiconductor device, the pattern representing information for operating the semiconductor device,
- wherein the pattern includes a plurality of bit areas, and wherein each of plurality of bit areas includes at least one dot or at least one vacant region.
Dependencies are inferred from the claim text.