Display module and substrate thereof having improved binding reliability of substrate and flexible circuit board

A module, comprising:

• an array substrate and a flexible circuit board, wherein:
• the array substrate includes a binding region;
• and the binding region includes a first binding region and a second binding region;
• and in the binding region, the flexible circuit board is bound with the array substrate through a conductive adhesive;
• in the first binding region, the array substrate includes a first conductive soldering pad;
• the flexible circuit board includes a second conductive soldering pad;
• and the first conductive soldering pad is electrically connected to the second conductive soldering pad, wherein an opening is provided above the first conductive soldering pad to expose the first conductive soldering pad, at least a part of the conductive adhesive is filled into the opening such that the first conductive soldering pad directly binds to the at least a part of the conductive adhesive;
• and
• in the second binding region, the array substrate includes one or more first soldering elements;
• the flexible circuit board includes one or more second soldering elements;
• a first soldering element of the one or more of first soldering elements is fixed with a second soldering element of the one or more of second soldering elements;
• and at least one first soldering element of the one or more of first soldering elements is insulated from the one or more of second soldering elements,
• wherein at least one first soldering element of the one or more of first soldering elements includes a groove, and at least a part of the conductive adhesive is in the groove.