Homogenous die stacking with increased element density

An integrated circuit device comprising:

• a semiconductor device;
• a plurality of microbumps;
• a top programmable fabric die comprising a first programmable fabric, a first through silicon via coupled to the semiconductor device, and a first microbump interface coupled to the plurality of microbumps, wherein the semiconductor device is coupled to the top programmable fabric die;
• and
• a base programmable fabric die comprising a second programmable fabric, a second through silicon via that is not exposed on any side of the base programmable fabric die, and a second microbump interface coupled to the first microbump interface via a coupling to the plurality of microbumps.

A method of manufacturing a programmable logic device, comprising:

• forming a first programmable logic die having a first plurality of through silicon vias using a process;
• forming a second programmable logic die having a second plurality of through silicon vias using the process;
• and
• mounting the first programmable logic die and the second programmable logic die together in a flip-chip package by flipping the first programmable logic die and by using microbumps to interconnect the first programmable logic die and the second programmable logic die.