Embedded packaging structure and manufacturing method thereof

A manufacturing method of an embedded packaging structure, comprising:

• providing a bearing plate, wherein a first metal seed layer is arranged on the bearing plate;
• processing on the first metal seed layer to obtain a substrate, wherein the substrate comprises a first circuit layer, a first metal column and a first insulating layer, the first circuit layer and the first metal column are both located in the first insulating layer, and the first metal column is further located on the first circuit layer;
• removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first cavity and a second cavity which penetrate through the substrate;
• assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, and processing on a second side of the substrate by using a photosensitive insulating material to obtain a second insulating layer covering the first component making local areas of the first circuit layer and the connecting flexible board exposed, so as to fix the first component and the connecting flexible board;
• processing on a first side of the substrate to obtain a second circuit layer, and assembling a second component on the second circuit layer, so that the first metal column and the first component are electrically connected with the second component through the second circuit layer respectively;
• and
• bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side of the substrate, and packaging the first side of the substrate by using a packaging material to obtain a packaging layer.