# US 12,599,015 B2 · Power module for vehicle > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,599,015 B2 - Document ID: US12599015B2 - Status: Granted - Kind: B2 - Application number: 18/137,595 - Filed: 2023-04-21 - Published: 2024-03-14 - Granted: 2026-04-07 - Earliest claimed: 2022-09-14 - Assignees: Hyundai Motor Company; Kia Corporation - Applicants: Hyundai Motor Company; Kia Corporation - Inventors: Jun Hee Park; Sung Taek Hwang; Nam Sik Kong; Myung Ill You - Web page: https://patentgrep.com/patent/US12599015B2 ## CPC - H10W 40/778: {in encapsulations} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/098: {Applying pastes or inks, e.g. screen printing (H10W70/095 takes precedence)} - H10W 72/073: {of die-attach connectors} - H10W 72/30: Die-attach connectors - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} - H10W 70/421: {Shapes or dispositions} - H10W 70/611: {for connecting multiple chips together} - H10W 72/07354: {changes in dispositions} - H10W 72/347: {Dispositions of multiple die-attach connectors} - H10W 72/851: {Dispositions of multiple connectors or interconnections} - H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad. ## Claims ### Claim 1 A power module for a vehicle, the power module comprising: a first substrate including a first metal circuit disposed on a first surface of the first substrate, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a first surface of the second substrate facing the first surface of the first substrate, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, wherein the first spacer and the second spacer are extended toward each other, and wherein the second spacer includes a second-1st spacer connected to the power pad and a second-2nd spacer connected to the signal pad, and wherein the first spacer and the second spacer contain glass frit in internal portions thereof except end portions thereof. ### Claim 2 (depends on 1) The power module of claim 1, further including: a signal lead disposed between the first metal circuit and the second metal circuit, wherein the signal lead is electrically connected to the signal pad via the second metal circuit and the second-2nd spacer. ### Claim 3 (depends on 1) The power module of claim 1, wherein the second-2nd spacer has a cross-sectional area that becomes smaller in a direction extending from the second metal circuit. ### Claim 4 (depends on 3) The power module of claim 3, wherein the cross-sectional area of the second-2nd spacer at an end portion in a direction extending from the second metal circuit is smaller by a preset percentage than a cross-sectional area at a side of the second metal circuit. ### Claim 5 (depends on 4) The power module of claim 4, wherein the preset percentage is greater than or equal to 30%. ### Claim 6 (depends on 3) The power module of claim 3, wherein the second-2nd spacer is in a shape of a truncated cone or a truncated polygonal pyramid, the cross-sectional area of which becomes smaller in the direction extending from the second metal circuit. ### Claim 7 (depends on 1) The power module of claim 1, further including a cooling layer connected to a cooler and disposed on at least one of a second surface of the first substrate opposite to the first surface of the first substrate and a second surface of the second substrate opposite to the first surface of the second substrate. ### Claim 8 (depends on 7) The power module of claim 7, wherein the cooling layer comprises a cooling layer of the first substrate and a cooling layer of the second substrate, and wherein the first substrate includes a first insulating layer between the first metal circuit and the cooling layer of the first substrate and a second insulating layer between the second metal circuit and the cooling layer of the second substrate. ### Claim 9 (depends on 1) The power module of claim 1, further including a power lead disposed between the first metal circuit and the second metal circuit. ### Claim 10 (depends on 9) The power module of claim 9, wherein the power lead is connected to at least one of the first metal circuit and the second metal circuit. ### Claim 11 (depends on 1) The power module of claim 1, wherein the first spacer and the second spacer are respectively extended from the first metal circuit and the second metal circuit by printing and curing a conductive paste through a screen or by curing a conductive molten material. ### Claim 12 (depends on 1) The power module of claim 1, wherein the second spacer further includes a second-3rd spacer and the first spacer and the second-3rd spacer of the second spacer extend toward each other in a predetermined direction and are electrically connected to form a via spacer. ### Claim 13 (depends on 12) The power module of claim 12, wherein the first spacer and the second-3rd spacer are formed integrally with the first and second circuit substrates. ### Claim 14 (depends on 13) The power module of claim 13, wherein the first spacer and the second-3rd spacer of the second spacer are electrically connected to each other by soldering. ### Claim 15 A method of manufacturing a power module, the method comprising: forming a metal circuit on a first surface of an insulating layer; and forming a plurality of spacers extending from the metal circuit in a predetermined direction, the forming of the plurality of spacers including: printing a conductive paste; and curing the printed conductive paste, and wherein the printing and the curing are repeated predetermined times, wherein the printing includes: seating a screen formed with a pattern; applying the conductive paste to the pattern; releasing the screen; and removing a deformed portion of the applied conductive paste stretched as the screen is released. ### Claim 16 (depends on 15) The method of claim 15, further including forming a cooling layer on a second surface opposite to the first surface of the insulating layer. ### Claim 17 (depends on 15) The method of claim 15, further including plating the metal circuit and the plurality of spacers.