Package device and manufacturing method thereof

A package device, comprising:

• a substrate;
• a plurality of first conductive pillars disposed on the substrate side by side;
• a redistribution layer disposed on the first conductive pillars;
• at least one bridge chip disposed between the substrate and the redistribution layer, wherein the bridge chip comprises a plurality of conductive bumps;
• a plurality of second conductive pillars disposed between the conductive bumps of the bridge chip and the redistribution layer, wherein the conductive bumps are bonded to the second conductive pillars, respectively;
• at least two active chips disposed on the redistribution layer, wherein the bridge chip is coupled between the active chips;
• an encapsulant disposed on the redistribution layer and surrounding the active chips;
• and
• a first underfill layer disposed between adjacent two of the first conductive pillars and between one of the first conductive pillars and the bridge chip, wherein the bridge chip is separated from the substrate by the first underfill layer, and the first underfill layer extends to and contacts a sidewall of the encapsulant.